Title:
SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH
Document Type and Number:
WIPO Patent Application WO/2007/010927
Kind Code:
A1
Abstract:
A solder free from lead for additional supply to control the Cu concentration
and Ni concentration in solder bath which sharply vary depending upon the particularity
of post-process; and a method of regulating the Cu concentration and Ni concentration
in solder bath under such particular conditions. A lead-free solder composed
mainly of Sn wherein at least Ni is contained in an amount of 0.01 to 0.5 mass% is
supplied to a solder bath employed for a work of printed board, copper lead wire
or copper tape furnished with a copper foil to be processed by an air knife or a die
after soldering. By charging of the lead-free solder of this composition, the
solder concentration in solder bath having been sharply changed by post-process
HASL unit or die is rapidly returned into an appropriate concentration range.
Inventors:
NISHIMURA TETSURO (JP)
Application Number:
PCT/JP2006/314240
Publication Date:
January 25, 2007
Filing Date:
July 19, 2006
Export Citation:
Assignee:
NIHON SUPERIOR SHA CO LTD (JP)
NISHIMURA TETSURO (JP)
NISHIMURA TETSURO (JP)
International Classes:
B23K35/26; B23K1/08; C22C13/00; H05K3/24; H05K3/34; B23K101/38
Foreign References:
| JP2001237536A | 2001-08-31 | |||
| JP2003082448A | 2003-03-19 | |||
| JPH04291990A | 1992-10-16 | |||
| JP2001217531A | 2001-08-10 | |||
| JP2000197988A | 2000-07-18 | |||
| JP2004261864A | 2004-09-24 | |||
| JP2000225490A | 2000-08-15 | |||
| JP2001287082A | 2001-10-16 | |||
| EP1189725A1 | 2002-03-27 | |||
| US3924794A | 1975-12-09 |
Other References:
See also references of EP 1911543A4
Attorney, Agent or Firm:
HAMADA, Toshiaki (2nd floor 8-8, Bakuro-machi 1-chome, Chuo-k, Osaka-shi Osaka 59, JP)
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