Title:
SOLDER HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/070604
Kind Code:
A1
Abstract:
A solder heating device, comprising an iron head member (20) in which an iron head tip (3) directly touching solder to fuse the solder is integrally fitted to the tip of a cylindrical member (6), a body side member (25) to which the base end side of the iron head member (20) is fitted and supporting the iron head member (20) through an elastic member (12), and a pressing means (2) formed so as to increase the pressing force of the elastic member (12) to press the base end side of the iron head member (20) by pressingly deforming the elastic member (12), wherein the pressing means (2) is formed switchable between a holding state in which the iron head member (20) is strongly supported with a large pressing force to fix the iron head member to the body side member and a releasing state in which the iron head member (20) is weakly supported with a small pressing force to detachably fit the iron head member to the body side member (25).
More Like This:
| JPS6084171 | [Title of the device] Solder Trowel |
Inventors:
MASAKI HIROYUKI (JP)
Application Number:
PCT/JP2004/000675
Publication Date:
August 04, 2005
Filing Date:
January 27, 2004
Export Citation:
Assignee:
HAKKO CORP (JP)
MASAKI HIROYUKI (JP)
MASAKI HIROYUKI (JP)
International Classes:
B23K3/02; B23K3/03; (IPC1-7): B23K3/02
Foreign References:
| JPH071120A | 1995-01-06 | |||
| US5683603A | 1997-11-04 | |||
| JP3031294U | 1996-11-22 |
Attorney, Agent or Firm:
Kotani, Etsuji (2-2 Nakanoshima 2-chome, Kita-k, Osaka-shi Osaka 05, JP)
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