SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, SOLDER JOINT, AND METHOD FOR CONTROLLING SOLDER MATERIAL

Title:

SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, SOLDER JOINT, AND METHOD FOR CONTROLLING SOLDER MATERIAL

Document Type and Number:

WIPO Patent Application WO/2016/071971

Kind Code:

A1

Abstract:

Provided is a solder material with which the thickness of an oxide film is controlled to a certain value or lower before solder melting and which exhibits oxidation resistance during and after solder melting. A Cu core ball 1A includes a Cu ball 2A, which maintains a gap between a semiconductor package and a printed circuit board, and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is constituted from Sn or a solder alloy mainly comprising Sn. The Cu core ball 1A has a brightness of 65 or higher in the L*a*b* color system and a yellowness of 7.0 lower in the L*a*b* color system, and more preferably has a brightness of 70 or higher and a yellowness of 5.1 or lower.

Inventors:

HATTORI TAKAHIRO (JP)
KAWASAKI HIROYOSHI (JP)
OKADA HIROSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)

Application Number:

PCT/JP2014/079347

Publication Date:

May 12, 2016

Filing Date:

November 05, 2014

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B23K35/14; B22F1/16; B22F1/17; B22F1/18; B23K35/26; C22C13/00; H01L21/60; C22F1/00; C22F1/08

Domestic Patent References:

WO2009090776A1	2009-07-23
WO2012118202A1	2012-09-07
WO2014109052A1	2014-07-17

Foreign References:

JP5590259B1	2014-09-17
JP5585751B1	2014-09-10
JP2009248156A	2009-10-29

Other References: