Title:
SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2018/159664
Kind Code:
A1
Abstract:
Provided is a solder material which is capable of suppressing the occurrence of electromigration. This solder material is a core ball 1A which comprises a spherical core 2A that is configured from Cu or a Cu alloy, and a solder layer 3A that covers the core 2A, and wherein the solder layer 3A has a Cu content of from 0.1% by mass to 3.0% by mass (inclusive), a Bi content of from 0.5% by mass to 5.0% by mass (inclusive), an Ag content of from 0% by mass to 4.5% by mass (inclusive) and an Ni content of from 0% by mass to 0.1% by mass (inclusive), with the balance being made up of Sn.
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Inventors:
NISHINO TOMOAKI (JP)
HATTORI TAKAHIRO (JP)
KAWASAKI HIROYOSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
HATTORI TAKAHIRO (JP)
KAWASAKI HIROYOSHI (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)
Application Number:
PCT/JP2018/007466
Publication Date:
September 07, 2018
Filing Date:
February 28, 2018
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B22F1/17; B23K35/14; B23K35/22; C22C13/00; C22C13/02; B22F1/065; B22F1/10
Domestic Patent References:
| WO2009131178A1 | 2009-10-29 | |||
| WO2015037279A1 | 2015-03-19 | |||
| WO2016071971A1 | 2016-05-12 | |||
| WO2012115268A1 | 2012-08-30 |
Foreign References:
| JP2007075856A | 2007-03-29 | |||
| JP2001225188A | 2001-08-21 | |||
| JP2014097532A | 2014-05-29 | |||
| JP6217836B1 | 2017-10-25 | |||
| JP2017094351A | 2017-06-01 | |||
| JP2010103501A | 2010-05-06 |
Other References:
See also references of EP 3590651A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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