Title:
SOLDER AND MOUNTED ARTICLE USING SAME
Document Type and Number:
WIPO Patent Application WO/2005/102594
Kind Code:
A1
Abstract:
Disclosed is an Sn-Zn alloy solder having a chemical composition comprising Zn: 7-10 mass%, Ag: 0.075-1 mass%, Al: 0.07-0.5 mass%, one or both of Bi: 0.01-6 mass% and Cu: 0.007-0.1 mass%, if necessary Mg: 0.007-0.1 mass%, and the balance of Sn and unavoidable impurities. This solder has workability, use conditions and bonding reliability equivalent to those of the conventional Sn-37 wt% Pb eutectic solders, and contains no lead which is harmful to humans.
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| JP3414388 | ELECTRONIC EQUIPMENT |
Inventors:
FUNAYA TAKUO (JP)
MYOHGA OSAMU (JP)
MATSUI KOJI (JP)
MYOHGA OSAMU (JP)
MATSUI KOJI (JP)
Application Number:
PCT/JP2005/007611
Publication Date:
November 03, 2005
Filing Date:
April 21, 2005
Export Citation:
Assignee:
NEC CORP (JP)
FUNAYA TAKUO (JP)
MYOHGA OSAMU (JP)
MATSUI KOJI (JP)
FUNAYA TAKUO (JP)
MYOHGA OSAMU (JP)
MATSUI KOJI (JP)
International Classes:
B23K35/22; B23K35/26; C22C13/00; H05K3/34; (IPC1-7): B23K35/26; B23K35/22; C22C13/00; H05K3/34
Foreign References:
| JPH11129091A | 1999-05-18 | |||
| JPH11320177A | 1999-11-24 |
Attorney, Agent or Firm:
Fujimaki, Masanori (Fukoku Seimei Building 2-2, Uchisaiwaicho 2-chom, Chiyoda-ku Tokyo 11, JP)
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