Title:
SOLDER PARTICLES, ELECTROCONDUCTIVE MATERIAL, SOLDER PARTICLE STORAGE METHOD, ELECTROCONDUCTIVE MATERIAL STORAGE METHOD, ELECTROCONDUCTIVE MATERIAL PRODUCTION METHOD, CONNECTION STRUCTURE, AND CONNECTION STRUCTURE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/124513
Kind Code:
A1
Abstract:
Provided are solder particles capable of effectively increasing the coalescence of solder when forming electroconductive connections. The solder particles according to the present invention comprise a solder particle body and an oxide film disposed on the outer surface of the solder particle body. The particle size of the solder particles is at least 0.01 μm and less than 1 μm. The average thickness of the oxide film is 5 nm or less.
Inventors:
SOU SHIKE (JP)
SADANAGA SHUUJIROU (JP)
ITOU MASAHIRO (JP)
SAITOU SATOSHI (JP)
ISHIZAWA HIDEAKI (JP)
SADANAGA SHUUJIROU (JP)
ITOU MASAHIRO (JP)
SAITOU SATOSHI (JP)
ISHIZAWA HIDEAKI (JP)
Application Number:
PCT/JP2018/047056
Publication Date:
June 27, 2019
Filing Date:
December 20, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B23K35/14; B23K35/22; H01B1/00; H01B1/22; H01B5/00; H01B5/16; H01B13/00; H01R11/01; H01R43/02; B23K35/26; C22C12/00; C22C13/00; H01R4/02
Domestic Patent References:
| WO2016031067A1 | 2016-03-03 | |||
| WO2015125778A1 | 2015-08-27 | |||
| WO2016140326A1 | 2016-09-09 |
Foreign References:
| JP2017100145A | 2017-06-08 | |||
| JP2013202632A | 2013-10-07 | |||
| JPH06155070A | 1994-06-03 | |||
| JP2000094179A | 2000-04-04 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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