Title:
SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/085077
Kind Code:
A1
Abstract:
The instant solder particles exhibit a proportion of composite solder particles, in which a plurality of solder particles are adhered, of not more than 5 number% in the total solder particles. Provided is a method for producing solder particles, comprising an impact force application step for applying an impact force to solder particles such that the proportion of composite solder particles, in which a plurality of solder particles are adhered, is not more than 5 number% in the total solder particles.
Inventors:
NAMIKI HIDETSUGU (JP)
YAMAGUCHI SARII (JP)
NISHIO TAKESHI (JP)
YAMAGUCHI SARII (JP)
NISHIO TAKESHI (JP)
Application Number:
PCT/JP2022/039652
Publication Date:
May 19, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B22F1/14; B22F1/00; B23K35/26; B23K35/40; C22C12/00
Foreign References:
| JPH05185290A | 1993-07-27 | |||
| JP2004211155A | 2004-07-29 | |||
| JP2007321227A | 2007-12-13 | |||
| JP2004018890A | 2004-01-22 | |||
| JPH02243701A | 1990-09-27 | |||
| JP2015105391A | 2015-06-08 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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