SOLDER PASTE FLUX, SOLDER PASTE, METHOD FOR FORMING SOLDER BUMP USING SOLDER PASTE, AND METHOD FOR PRODUCING JOINED BODY

Title:

SOLDER PASTE FLUX, SOLDER PASTE, METHOD FOR FORMING SOLDER BUMP USING SOLDER PASTE, AND METHOD FOR PRODUCING JOINED BODY

Document Type and Number:

WIPO Patent Application WO/2019/022193

Kind Code:

A1

Abstract:

This solder paste flux comprises a thickening agent, a solvent, and a thixotropic agent, and that has an acid value of at most 100 mgKOH/g, exhibits a mass reduction rate of at least 80 mass% at 300°C by thermogravimetric measurement, and has a viscosity of at least 0.5 Pa·s and a tacking force of at least 1.0 N.

Inventors:

YASOSHIMA TSUKASA (JP)
ISHIKAWA MASAYUKI (JP)

Application Number:

PCT/JP2018/028062

Publication Date:

January 31, 2019

Filing Date:

July 26, 2018

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

B23K35/363; B23K1/00; B23K35/26; B23K35/30; C22C5/02; C22C11/06; C22C13/00; H05K3/34

Foreign References:

JP2014138019A	2014-07-28
JP2008246563A	2008-10-16
JP2016078095A	2016-05-16

Attorney, Agent or Firm:

MATSUNUMA Yasushi et al. (JP)

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