Title:
SOLDER PASTE FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2018/025903
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a solder paste flux with which it is possible to form a solder joint that produces less voids. The solder paste flux according to the present invention contains, as the main component, an organic component that comprises an aliphatic acid and an aliphatic primary amine.
Inventors:
YAMAMOTO YUKI (JP)
OOTANI SATOSHI (JP)
FURUSAWA MITSUYASU (JP)
OOTANI SATOSHI (JP)
FURUSAWA MITSUYASU (JP)
Application Number:
PCT/JP2017/028007
Publication Date:
February 08, 2018
Filing Date:
August 02, 2017
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
B23K35/363; B23K35/26; B23K35/30; H01B1/22; C22C9/02; C22C13/00; C22C13/02
Foreign References:
| JPH10505006A | 1998-05-19 | |||
| JP2004176179A | 2004-06-24 |
Other References:
See also references of EP 3495090A4
Attorney, Agent or Firm:
FUJIMOTO, Noboru (JP)
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