SOLDER PASTE, SOLDERING METHOD USING SAID SOLDER PASTE AND JOINTED PRODUCT PREPARED BY SAID SOLDERING METHOD

Title:

SOLDER PASTE, SOLDERING METHOD USING SAID SOLDER PASTE AND JOINTED PRODUCT PREPARED BY SAID SOLDERING METHOD

Document Type and Number:

WIPO Patent Application WO/2001/058639

Kind Code:

A1

Abstract:

A solder paste which comprises a halogen compound as an activator in such an amount as to give a halogen ion concentration per 1 g of the flux used in the paste of 3,000 ppm or less in terms of a chlorine ion; a method for soldering using the solder paste; and a jointed product prepared by using the soldering method. The solder paste exhibits excellent storage stability.

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Inventors:

AMITA HITOSHI (JP)
MURASE NORIKO (JP)
SHOJI TAKASHI (JP)

Application Number:

PCT/JP2001/000877

Publication Date:

August 16, 2001

Filing Date:

February 08, 2001

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)
AMITA HITOSHI (JP)
MURASE NORIKO (JP)
SHOJI TAKASHI (JP)

International Classes:

B23K1/00; B23K35/02; B23K35/22; B23K35/36; B23K35/363; H05K3/34; B23K35/26; (IPC1-7): B23K35/363; B23K35/22; H05K3/34

Foreign References:

JPH09327789A	1997-12-22
JPH11267885A	1999-10-05
JPH091382A	1997-01-07
JPH106074A	1998-01-13

Attorney, Agent or Firm:

Fukuda, Kenzo (Nishishinbashi 1-chome Minato-ku Tokyo, JP)

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