Title:
SOLDER PASTE, WELDING METHOD FOR LED AND BONDING PAD, AND LED DISPLAY UNIT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/110818
Kind Code:
A1
Abstract:
A solder paste (3), a welding method for an LED (1) and a bonding pad (2), and an LED display unit and a manufacturing method therefor. The welding method comprises: adding a dark dye powder having a mass fraction of 1% to 10% and a powder diameter of less than 100 nm into a solder paste (3), and uniformly stirring same; and spot welding the solder paste (3) onto a bonding pad (2) of a PCB (4), and welding an LED (1), such that an LED display unit as a whole is the color of the dark dye powder.
Inventors:
HU WEIJIE (CN)
ZHANG JINGANG (CN)
SUN TIANPENG (CN)
ZHANG JINGANG (CN)
SUN TIANPENG (CN)
Application Number:
PCT/CN2021/105236
Publication Date:
June 02, 2022
Filing Date:
July 08, 2021
Export Citation:
Assignee:
UNILUMIN GROUP CO LTD (CN)
International Classes:
B23K3/06; B23K3/00; B23K3/08
Foreign References:
| CN112536494A | 2021-03-23 | |||
| CN109873073A | 2019-06-11 | |||
| CN109411376A | 2019-03-01 | |||
| CN111136402A | 2020-05-12 | |||
| CN105374924A | 2016-03-02 | |||
| CN108767087A | 2018-11-06 | |||
| CN103586597A | 2014-02-19 | |||
| CN109262162A | 2019-01-25 | |||
| CN110091093A | 2019-08-06 | |||
| CN101112736A | 2008-01-30 | |||
| EP1693142A1 | 2006-08-23 | |||
| US5650020A | 1997-07-22 |
Attorney, Agent or Firm:
SHENZHEN XIECHENG INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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