Title:
SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/1999/001251
Kind Code:
A1
Abstract:
A tin-zinc solder paste containing 0.5 to 5 % by weight of a compound obtained by the addition reaction between ethylene oxide and cyclohexylamine and preferably 0.5 to 5 % by weight of a polyoxyethylenealkylamine in a flux in order to protect the paste from a change with time.
Inventors:
NOGUCHI HIROJI (JP)
HIRATA MASAHIKO (JP)
TAGUCHI TOSHIHIKO (JP)
TAKAURA KUNIHITO (JP)
HIRATA MASAHIKO (JP)
TAGUCHI TOSHIHIKO (JP)
TAKAURA KUNIHITO (JP)
Application Number:
PCT/JP1998/002929
Publication Date:
January 14, 1999
Filing Date:
June 30, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
SENJU METAL INDUSTRY CO (JP)
NOGUCHI HIROJI (JP)
HIRATA MASAHIKO (JP)
TAGUCHI TOSHIHIKO (JP)
TAKAURA KUNIHITO (JP)
SENJU METAL INDUSTRY CO (JP)
NOGUCHI HIROJI (JP)
HIRATA MASAHIKO (JP)
TAGUCHI TOSHIHIKO (JP)
TAKAURA KUNIHITO (JP)
International Classes:
B23K35/02; B23K35/26; B23K35/36; (IPC1-7): B23K35/363; B23K35/22; H05K3/34
Foreign References:
| JPH04313487A | 1992-11-05 | |||
| JPS5376942A | 1978-07-07 |
Other References:
See also references of EP 0931622A4
Attorney, Agent or Firm:
Hirose, Shoichi (4-2 Nihonbashi Honcho 4-chom, Chuo-ku Tokyo, JP)
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