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Patent Searching and Data


Title:
SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2013/099853
Kind Code:
A1
Abstract:
Provided is a solder paste, whereby it becomes possible to overcome the problem of clogging of a nozzle which usually occurs suddenly when used in a discharge method, and it also becomes possible to decompose a flux through heating employed in soldering to thereby leave nothing as a residue. A solder paste produced by mixing a solder powder with a flux, wherein the flux contains 1.0 mass% or more and less than 2.0 mass% of a polyalkyl methacrylate as a methacrylic acid polymer in such an amount that the sedimentation of the solder powder can be prevented in an ambient temperature region and the solder powder can be decomposed or evaporated during the heating for soldering and additionally contains 5.0 mass% or more and less than 15.0 mass% of stearic acid amide as a viscosity modifier, and wherein the viscosity of the solder paste is 50 to 150 Pa·s. The content of the flux in the solder paste is preferably 11 mass% or more and less than 13 mass%.

Inventors:
OKADA SAKIE (JP)
KOROKI MOTOKI (JP)
ISEKI HIROAKI (JP)
ITOYAMA TARO (JP)
SAKAMOTO YOSHITSUGU (JP)
HAYASHI HIROMASA (JP)
Application Number:
PCT/JP2012/083444
Publication Date:
July 04, 2013
Filing Date:
December 25, 2012
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
DENSO CORP (JP)
International Classes:
B23K35/363
Domestic Patent References:
WO2012118076A12012-09-07
WO2012118077A12012-09-07
Foreign References:
JPH02290693A1990-11-30
JP2004025305A2004-01-29
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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Claims:



 
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