SOLDER PASTE

WIPO Patent Application WO/2014/021204

A1

This solder paste can be produced by mixing a flux which comprises a solvent, a rosin, a thixotropic agent and an activator with a solder powder which has a mean particle diameter of 0.1 to 5μm. The solder powder is composed of composite particles, each of which comprises: a core; a first covering layer which consists of a copper-tin intermetallic compound and which covers at least a part of the core; and a second covering layer which consists of tin and which covers all the exposed surfaces of the core and the first covering layer. The core has a single structure which consists of a silver-tin intermetallic compound. The activator contains, relative to 100 mass% of the flux, 0.3 to 0.6 mass% of a hydrohalic acid amine salt and 0.1 to 10 mass% of a compound other than hydrohalic acid amine salts, said compound being an amine, an organohalogen compound, an organic acid, an organic acid ammonium salt, an organic acid amine salt or the like.

JP6572995	Cu core balls, solder fittings, solder pastes and foam solders
JP2003290911	SOLDERING METHOD
JP3763520	SOLDERING COMPOSITION AND SOLDERING METHOD

UESUGI RYUJI (JP)
UNO HIRONORI (JP)

PCT/JP2013/070285

February 06, 2014

July 26, 2013

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MITSUBISHI MATERIALS CORP (JP)

B23K35/22; B22F1/107; B22F1/17; B23K35/14; B23K35/363; B22F9/24; B23K35/26; B23K35/30; B23K35/40; C22C5/06; C22C9/02; C22C13/00

WO2007125861A1	2007-11-08
WO2008004531A2	2008-01-10
WO2011151894A1	2011-12-08
WO2013031588A1	2013-03-07

JP2008138266A	2008-06-19
JP2008062252A	2008-03-21

SUDA, MASAYOSHI (JP)
Masayoshi Suda (JP)

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