Title:
SOLDER POWDER AND PREPARATION METHOD FOR SOLDER PASTE USING SAID POWDER
Document Type and Number:
WIPO Patent Application WO/2017/094713
Kind Code:
A1
Abstract:
A solder powder (10) of the present invention comprises a core (11) made of silver, a coating layer (12) that coats the core (11) and is made of tin, and a diffusion-preventing layer (13) that is made of nickel and is between the core and the coating layer. The average grain diameter of the solder powder (10) is 1 μm to 30 μm. The proportional content of silver relative to 100 mass% of the entire amount of the solder powder (10) is 10 mass% to 81 mass%. In a solder powder (10) of the present invention, the thickness of the diffusion-preventing layer (13) made of nickel is proportionally 0.04-0.50 if the radius of the core (11) is taken as 1. A method for preparing a solder paste of the present invention is a method in which a solder paste is prepared by mixing a solder powder (10) of the present invention with a flux for solder and converting the mixture to a paste.
Inventors:
UESUGI RYUJI (JP)
Application Number:
PCT/JP2016/085389
Publication Date:
June 08, 2017
Filing Date:
November 29, 2016
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B23K35/14; B22F1/00; B23K35/26; B23K35/30; C22C5/06; C22C13/00; H05K3/34
Foreign References:
| JP2014193474A | 2014-10-09 | |||
| JP2012157870A | 2012-08-23 | |||
| JPH02179385A | 1990-07-12 | |||
| JP2010099736A | 2010-05-06 |
Attorney, Agent or Firm:
SUDA, Masayoshi (JP)
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