Title:
SOLDER PRINTER
Document Type and Number:
WIPO Patent Application WO/2017/168755
Kind Code:
A1
Abstract:
A solder printer, which performs printing using cream solder on a substrate, is configured so as to: allow changing of the position of a squeegee 70 in the substrate conveyance direction; and enable the printer to selectively assume first work configurations (a-1), (a-2) in which printing is possible in at least one of two regions R1 and R2 that are side by side in the conveyance direction and a second work configuration (b) in which printing is possible in a single region R3, which comprises a region R0 between said two regions and at least a portion of each of the two regions. The present invention increases the versatility of the solder printer because printing can be respectively performed on substrates S that are small in the conveyance direction in the two regions R1 and R2 and on substrates that are large in the single region R3.
Inventors:
KONDO TAKESHI (JP)
Application Number:
PCT/JP2016/060946
Publication Date:
October 05, 2017
Filing Date:
April 01, 2016
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B41F15/40; B41F15/26; B41F15/42; H05K3/12; H05K3/34
Foreign References:
| JPH10138452A | 1998-05-26 | |||
| JP2006007625A | 2006-01-12 | |||
| JP2011143640A | 2011-07-28 | |||
| JPH0557871A | 1993-03-09 |
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
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