Title:
SOLDER PRINTING MACHINE AND METHOD FOR CONTROLLING SOLDER PRINTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2017/090144
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a solder printing machine that can improve printing quality by preventing cream solder from adhering to a rear surface of a squeegee and a method for controlling the solder printing machine.
A controller of the solder printing machine performs: a primary lowering step of primarily lowering the squeegee down to a preparing height at which a lower end of cream solder adhering to the squeegee adheres to an upper surface of a screen; a retracting step of retracting the squeegee in a retracting direction opposite to an advancing direction of the squeegee in a printing process; a secondary lowering step of secondarily lowering the squeegee down to a prescribed printing height at which a lower end of the squeegee contacts the screen; and a printing step of sliding the squeegee along the screen.
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Inventors:
KATO MITSUAKI (JP)
Application Number:
PCT/JP2015/083203
Publication Date:
June 01, 2017
Filing Date:
November 26, 2015
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B41F15/42; B41F15/40; H05K3/12; H05K3/34
Foreign References:
| JP2001047598A | 2001-02-20 | |||
| JPH11147306A | 1999-06-02 |
Attorney, Agent or Firm:
KOBAYASHI Osamu et al. (JP)
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