Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOLDER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/048113
Kind Code:
A1
Abstract:
This solder processing device comprises: a storage tank 110 which is for containing a molten solder S; and an extension part 210 which is at least partially immersed in the molten solder S inside the storage tank 110 and which extends in the molten solder S. The extension part 210 reciprocates in the horizontal direction in the molten solder S.

Inventors:
KAWASHIMA YASUJI (JP)
ICHIKAWA HIROKAZU (JP)
TOMITSUKA KENICHI (JP)
Application Number:
PCT/JP2022/034897
Publication Date:
March 30, 2023
Filing Date:
September 20, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K3/06; B23K1/00; B23K1/08
Domestic Patent References:
WO2000002695A12000-01-20
Foreign References:
JPH0732978U1995-06-16
JPS61111663U1986-07-15
US20090261147A12009-10-22
JP2003053529A2003-02-26
JP2002080950A2002-03-22
Attorney, Agent or Firm:
UMEDA Shinsuke et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: BLOOD CELL SEPARATING AGENT FOR ANALYSIS AND BLOOD CELL SEPARATION METHOD

Next Patent: RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, AND METHOD FOR PRODUCING STRUCTURE BODY INC...