Title:
SOLDER SUPPLY DEVICE, SOLDER SUPPLY METHOD, AND PRINTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/013881
Kind Code:
A1
Abstract:
The present invention relates to a solder supply device that comprises a storage pot, a mobile body, a mobile body drive mechanism, and a control unit. The storage pot has a storage space that stores solder and a discharge port that is provided in the bottom of the storage pot and communicates with the storage space. The storage pot can discharge solder downward from the discharge port. The mobile body can move in the vertical direction inside the storage space while covering the solder stored in the storage space from above. The mobile body drive mechanism has a first opening/closing unit that switches between pressure feed and suspension of pressure feed of air into a non-storage area of the storage space that is above the mobile body. The mobile body drive mechanism depresses the mobile body by pressure feeding air into the non-storage area via the first opening/closing unit. The control unit controls the mobile body drive mechanism such that solder is discharged from the discharge port by depression of the mobile body.
Inventors:
SAITO YOSHIKI (JP)
Application Number:
PCT/JP2022/027564
Publication Date:
January 18, 2024
Filing Date:
July 13, 2022
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
B23K3/06
Domestic Patent References:
| WO2005115730A1 | 2005-12-08 |
Foreign References:
| JP2015174119A | 2015-10-05 | |||
| JP2013184145A | 2013-09-19 | |||
| JP2020044473A | 2020-03-26 | |||
| JP2008049597A | 2008-03-06 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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