Title:
SOLDER SUPPLY DEVICE AND SOLDER SUPPLY METHOD
Document Type and Number:
WIPO Patent Application WO/2015/128994
Kind Code:
A1
Abstract:
The present invention is a solder supply device (26) provided with a solder cup (70) containing in the interior thereof solder in fluid form, a positive/negative pressure supply device for changing the pressure within the solder cup in controllable fashion, a supply nozzle (74) for discharging the solder within the solder cup, and a solder cutting device (77) for cutting the solder supplied from the supply nozzle, with a blast of compressed air. Solder is supplied from the supply nozzle by pressurizing the solder cup interior using the positive/negative pressure supply device; and when halting the supply of solder from the supply nozzle, the solder cup interior is depressurized by the positive/negative pressure supply device, and the solder is cut by the solder cutting device at timing coincident with depressurization of the solder cup interior. In so doing, cutting of the solder from the supply nozzle and retraction of the solder back into the supply nozzle take place simultaneously, whereby it is possible to reliably prevent dripping of the solder.
More Like This:
Inventors:
HIRUKAWA RITSUO (JP)
KATO TAKENOBU (JP)
ASAOKA KENTO (JP)
KATO TAKENOBU (JP)
ASAOKA KENTO (JP)
Application Number:
PCT/JP2014/054901
Publication Date:
September 03, 2015
Filing Date:
February 27, 2014
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B23K3/06; B05C5/00; H05K3/34
Foreign References:
| JP2011031301A | 2011-02-17 | |||
| JPS6372372A | 1988-04-02 | |||
| JPH06285412A | 1994-10-11 | |||
| US4517917A | 1985-05-21 | |||
| JP2002137360A | 2002-05-14 | |||
| JP2004058299A | 2004-02-26 |
Other References:
See also references of EP 3112070A4
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
Patent business corporation NeXT (JP)
Patent business corporation NeXT (JP)
Download PDF: