Title:
SOLDER SUPPLY DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/157226
Kind Code:
A1
Abstract:
Provided is a solder supply device that supplies molten solder all at once to a plurality of points on a target that is mounted on a stage. The solder supply device comprises a solder pot, a shutter unit, a first actuator, a second actuator, and a control unit. During the interval between loading of the target to the stage and unloading of the target from the stage after molten solder has been supplied, the control unit controls the second actuator so that the bottom outer surface of the solder pot moves from a non-contact position to a contact position, then returns to the non-contact position, and controls the first actuator so that the shutter unit moves from a closed position to an open position, then returns to the closed position. When in the closed position, the molten solder in a cutout space defined by the shutter unit, the wall surface of a through hole, and the target, is separated from the molten solder that is in the solder pot, and when the solder pot returns from the contact position to the non-contact position, the molten solder from the cutout space is transferred to the plurality of points on the target.
Inventors:
FURUMOTO ATSUSHI (JP)
KAMIMURA RIKIYA (JP)
INOMATA NORIYASU (JP)
SONODA YASUHIDE (JP)
KAMIMURA RIKIYA (JP)
INOMATA NORIYASU (JP)
SONODA YASUHIDE (JP)
Application Number:
PCT/JP2013/002435
Publication Date:
October 24, 2013
Filing Date:
April 10, 2013
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
B23K3/06; H01L21/52; B23K101/40
Foreign References:
| JP2000349429A | 2000-12-15 | |||
| JPS5874276A | 1983-05-04 | |||
| JP2003133716A | 2003-05-09 |
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
Gold Junki (JP)
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