Title:
SOLDER SUPPLY DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/092877
Kind Code:
A1
Abstract:
A solder supply device (26) for supplying solder inside a solder cup through the tip of a nozzle part by movement of the solder cup, said device being provided with: a solder cup (70) describing a cylindrical shape with an open end, the interior of the cup accommodating liquid solder; a nozzle part (88) inserted inside the solder cup, and adapted for discharging the solder inside the solder cup to the exterior; and a flange part (90) provided on the outer peripheral part of the nozzle part, the flange part being fitted inside the solder cup; wherein a magnet (81) is installed on the outer peripheral surface of the solder cup, and magnetic sensors (150, 152) capable of detecting the proximity of the magnet being installed in a position facing the outer peripheral surface of a solder container. According to the positions in which the magnet and the magnetic sensors are installed, it is thereby possible for the position of the solder cup after movement to be detected, and depletion of the solder in the solder cup to be accurately detected.
Inventors:
FUJITA YOJI (JP)
Application Number:
PCT/JP2013/083853
Publication Date:
June 25, 2015
Filing Date:
December 18, 2013
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B23K3/06; B41F15/40; H05K3/34
Foreign References:
| JP2004306102A | 2004-11-04 | |||
| JPH06106111A | 1994-04-19 | |||
| JP2012106416A | 2012-06-07 | |||
| JP2013103418A | 2013-05-30 | |||
| JP2003535465A | 2003-11-25 | |||
| JP2003311930A | 2003-11-06 | |||
| JP2005096126A | 2005-04-14 | |||
| JP2013123889A | 2013-06-24 | |||
| JP2013123890A | 2013-06-24 | |||
| JP2012106416A | 2012-06-07 |
Other References:
See also references of EP 3085484A4
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
Patent business corporation NeXT (JP)
Patent business corporation NeXT (JP)
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