Title:
SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER
Document Type and Number:
WIPO Patent Application WO/2012/132175
Kind Code:
A1
Abstract:
In order to provide a solder transfer base which enables a transfer without breaking a fragile film of a semiconductor element that has a fragile dielectric film, the present invention provides a solder transfer base (5), which is provided with a base layer (1), an adhesive layer (2) that is arranged on the base layer (1), and a plurality of solder particles (3) that are arranged on the adhesive layer (2). The base layer (1) is a porous member, and is provided with a plurality of pores that pass through at least a remover liquid from the side on which the adhesive layer (2) is not arranged to the side on which the adhesive layer (2) is arranged. In addition, the adhesive layer (2) has such a characteristic that the adhesive layer (2) is expanded when the remover liquid is injected thereinto.
Inventors:
SAKURAI DAISUKE
Application Number:
PCT/JP2012/000462
Publication Date:
October 04, 2012
Filing Date:
January 25, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
SAKURAI DAISUKE
SAKURAI DAISUKE
International Classes:
H05K3/34; B23K1/00; B23K1/20; B23K3/06; B23K35/14; B23K35/40; H01L21/60; B23K35/26; B23K101/42; C22C13/00
Foreign References:
| JPH07336033A | 1995-12-22 | |||
| JP2006114735A | 2006-04-27 | |||
| JPH1075043A | 1998-03-17 | |||
| JP2009010302A | 2009-01-15 | |||
| JP2002190661A | 2002-07-05 |
Attorney, Agent or Firm:
TOKKYOGYOMUHOUJIN MATSUDAKOKUSAITOKKYOJIMUSYO (JP)
Patent business corporation Matsuda international patent firm (JP)
Patent business corporation Matsuda international patent firm (JP)
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Claims: