The Field of the Invention

Invention relates to one-to-one solder adapter passing structure used in communication applications covering GSM2-3G-4G LTE bands.

The invention particularly relates to an structure connecting two RF cables by soldering method inside same bath at S band without terminating connector and without use of adapter.

Background of the Invention

Base station antenna comprises antenna located at various distances onto a reflector, phase shifter and PCB card (divider, diplexer, filter etc.) members. Mechanical interconnection housings can be used instead of cables terminated with RF connector for mounting of the antenna members. Number of members used in mechanical interconnection housing connector and/or adapter interconnections is high.

Interactions of mechanical members generally cause non-linear actions (loose cable connections, dirty connectors etc.). Inter-modulation occurring when two or more signals pass through a passive device having non-linear features is called PIM (Passive Intermodulation Distortion/ Passive Intermodulation). PIM particularly may cause interference between mechanical embodiments. This reduces receiver accuracy or completely prevents communication. For that reason, need to provide low PIM value is essential. However, in the present related art, low PIM value can not be provided because of use of connector and/or adapter for RF cables connection.

Following test parameters of antennas used in GSM2-3G-4G LTE bands are the most critical design parameters.

• S parameters (Interference Loss-S21 and Reflection Loss-S11)

• PIM (Passive Intermodulation Distortion)

Particularly, problems experienced during production process negatively affect the criteria required in those two parameters. In the present application of the related art, on the mechanic chassis RF cable is passed through hole on the chassis and soldered to chassis wall. Center pins are also soldered inside chassis. This case causes chassis failure to have earth due to inconvenient soldering and results in reduction in conductivity. This causes low PIM values in measurements and undesired VSWR issues (see Figure 1 ). During search of the related art application numbered CN209088179U is encountered. The application relates to a cable assembly providing location of radio frequency cable by spiral cavity. Since assembly is made by means of mechanic modulation structures, low PIM value cannot be achieved on the system.

As a result, due to above-described disadvantages and inadequacy of existing solutions it has been necessary to make development in the related art.

Aim of the Invention

Differently from the existing related art, the invention aims to disclose a structure having different technical features providing a new solution.

Primary aim of the invention is to provide low PIM value inside the system by joining two RF cables by use of soldering method.

Aim of the invention is to provide higher performance indication of the system by one-to-one soldering and thus improvement in terms of productivity.

In order to achieve aims described above, the invention is a mechanic structure wherein at least two cables are connected by soldering method and used in communication applications containing GSM2-3G-4G LTE bands and comprises a sub-base wherein all surfaces are soldered upon passing cables through therein, covering cable screens by forming a structure in form C in convenient depth, a top structure where all center pins of said cables are soldered in order to provide center pin transmission, an intermediate structure between substructure and top structure in order to provide electrical insulation between metal substructure and top structure and PIM insulation therein.

The structural and characteristics features of the invention and all advantages will be understood better in detailed descriptions with the figures given below and with reference to the figures, and therefore, the assessment should be made taking into account the said figures and detailed explanations.

Description of Figures

Figure 1 is view showing soldering of RF cable onto chassis in the related art.

Figure 2 is view of mechanic structure of the invention,

Figure 3 is a view showing insulating part embodied in a manner to wrap other mechanical structures.

The drawings are not necessarily to be scaled and the details not necessary for understanding the present invention might have been neglected. In addition, the components which are equivalent to great extent at least or have equivalent functions at least have been assigned the same number.

Description of Part References

1 . Sub-structure

2. Top structure

3. Intermediate structure

4. Insulating part

Detailed Description of the Invention

In this detailed description, the preferred embodiments of the invention have been described in a manner not forming any restrictive effect and only for purpose of better understanding of the matter.

Subject of the invention in general is a one-to-one soldered mechanic modulation structure used in base station antennas and all mechanical structure comprises a sub-structure (1), top structure (2) and intermediate structure (3) and all located inside an insulating part (4). In order to enable cables to complete RF path, a sub-structure (1) of detail similar to C grasping cable screens and providing meeting of required criteria of conductivity. Said C shape structure is designed in a manner to be integrated to entire embodiment.

A space of convenient depth is provided inside sub-structure (1) in order to provide full compatibility of mechanic structure to cable screen of chassis in terms of conductivity, Said sub-structure (1) is manufactured by means of preferably aluminium compressing casting method. Center pins of cables are soldered to top structure (2) by help of metal part such as copper, phospho-bronze etc. having high electrical conductivity and thus center pin transmission is provided. Thus cables are passed over the structure with hole (C detail) inside sub-structure (1) and all surfaces of cables can be soldered.

Intermediate structure (3) is provided to achieve electrical insulation between metal substructure (1) and top structure (2). Intermediate structure (3) is made from a material such as good insulating and also high melting temperature such as Teflon etc. Intermediate structure (3) also has positive effects for PIM insulation.

Insulating part (4) entirely wraps sub-structure (1), top structure (2) and intermediate structure (3) and is the part wherein said structures (1 , 2, 3) are located. Thus contact with other metals inside the antenna is prevented. Said insulating part (4) is made from preferably Polyoxymethylene (POM) material. Electrical insulation on RF line is enhanced by means of cavities formed on side walls of the sub-structure (1 ). Thus loss of going in between and reflection losses are recovered. Reflection losses are also recovered by use of different sizes on top structure (2).