Title:
SOLDERING APPARATUS AND METHOD FOR MANUFACTURING SOLDERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2013/161875
Kind Code:
A1
Abstract:
Provided are an excellent soldering apparatus, which is capable of efficiently soldering a workpiece in a short cycle time, and a method for manufacturing a soldered product.
This soldering apparatus is provided with: a thermal radiation heater, which heats, by means of thermal radiation, a workpiece to be soldered; and two cooling apparatuses, which cool a soldered workpiece, and which are disposed to sandwich the thermal radiation heater, and which move between a standby position and a cooling position, said cooling apparatuses having a recessed portion formed therein for the purpose of being provided with the thermal radiation heater sandwiched between the two cooling apparatuses. The cooling apparatuses are configured movable to the standby position where the cooling apparatuses stand by by being spaced apart from the workpiece such that the thermal radiation heater is protruding from the recessed portion, while the thermal radiation heater is heating the workpiece, and the cooling apparatuses are configured movable from the standby position to the cooling position when the cooling apparatuses cool the workpiece.
Inventors:
KURODA MASAMI (JP)
MATSUDA JUN (JP)
SUZUKI TAKAYUKI (JP)
MATSUDA JUN (JP)
SUZUKI TAKAYUKI (JP)
Application Number:
PCT/JP2013/062063
Publication Date:
October 31, 2013
Filing Date:
April 24, 2013
Export Citation:
Assignee:
ORIGIN ELECTRIC (JP)
International Classes:
B23K1/008; B23K1/00; B23K1/005; B23K3/04; B23K31/02; H05K3/34; B23K101/42
Foreign References:
| JPH06170528A | 1994-06-21 | |||
| JPS63165069A | 1988-07-08 | |||
| GB1236103A | 1971-06-23 | |||
| JP3409679B2 | 2003-05-26 |
Other References:
See also references of EP 2842682A4
Attorney, Agent or Firm:
MIYAGAWA, Teiji et al. (JP)
Teiji Miyagawa (JP)
Teiji Miyagawa (JP)
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