Title:
SOLDERING APPARATUS AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/056667
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve connection reliability by reducing fusion failures between solder bumps and a solder paste, in a circuit board and a component having solder bumps for connection when using a lead-free solder, compared with fusion failures in the cases where methods for obtaining an inertial force by sinusoidally oscillating the board in the vertical direction using a crank mechanism, a vibration motor and the like are used. To achieve the purpose, a soldering apparatus which connects a circuit board by reflow soldering, while vertically moving the circuit board is provided. The soldering apparatus has a drive mechanism, which can vertically move a circuit board holder asymmetrically, said circuit board holder having the circuit board placed thereon, and which can make the circuit board holder quickly move upward and slowly move downward.
Inventors:
NAKATSUKA TETSUYA (JP)
Application Number:
PCT/JP2011/005918
Publication Date:
May 03, 2012
Filing Date:
October 24, 2011
Export Citation:
Assignee:
HITACHI LTD (JP)
NAKATSUKA TETSUYA (JP)
NAKATSUKA TETSUYA (JP)
International Classes:
H05K3/34; B23K1/00; B23K1/06; B23K3/00
Foreign References:
| JP2007281272A | 2007-10-25 | |||
| JPH08330722A | 1996-12-13 | |||
| JP2009094370A | 2009-04-30 |
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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Claims: