Title:
SOLDERING APPARATUS AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/015830
Kind Code:
A1
Abstract:
A flow rate detection unit (73) indirectly detects a flow rate of a solder to be jetted from a jet nozzle (22) by detecting a flow rate of a gas to be supplied to a solder storing tank (5). A pressure instruction unit (10a) and a pressure adjustment unit (72) adjust pressure of the gas to be supplied to the solder storing tank (5) on the basis of the gas flow rate detected by means of the flow rate detection unit (73), and makes the flow rate of the gas to be supplied to the solder storing tank (5) constant.
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Inventors:
HAYASHI HISAKI (JP)
Application Number:
PCT/JP2014/057909
Publication Date:
February 05, 2015
Filing Date:
March 20, 2014
Export Citation:
Assignee:
FUJITSU TEN LTD (JP)
International Classes:
B23K1/08; B23K1/00; H05K3/34; B23K101/42
Foreign References:
| JPH0590467A | 1993-04-09 | |||
| JP2000071066A | 2000-03-07 | |||
| US20080067219A1 | 2008-03-20 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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