Title:
SOLDERING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1995/018696
Kind Code:
A1
Abstract:
A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0 % to about 10.5 % by weight bismuth.
Inventors:
HAN TIPPY
HAN PHODI
HAN PHODI
Application Number:
PCT/US1995/000189
Publication Date:
July 13, 1995
Filing Date:
January 06, 1995
Export Citation:
Assignee:
QUALITEK INTERNATIONAL INC (US)
International Classes:
B23K35/26; C22C13/00; (IPC1-7): B23K35/26
Foreign References:
| DE1080838B | 1960-04-28 | |||
| US4806309A | 1989-02-21 | |||
| EP0568952A1 | 1993-11-10 | |||
| GB2096036A | 1982-10-13 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 6, no. 50 (M - 120)<928> 3 April 1982 (1982-04-03)
O.I. CHIRINO ET AL: "High creep strenght alloy", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 23, no. 8, NEW YORK US, pages 3620
IRVING B.: "Host of New Lead-Free Solders Introduced", WELDING JOURNAL INCLUDING: WELDING RESEARCH, vol. 71, no. 10, 1 October 1992 (1992-10-01), MIAMI US, pages 47 - 49, XP000310155
O.I. CHIRINO ET AL: "High creep strenght alloy", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 23, no. 8, NEW YORK US, pages 3620
IRVING B.: "Host of New Lead-Free Solders Introduced", WELDING JOURNAL INCLUDING: WELDING RESEARCH, vol. 71, no. 10, 1 October 1992 (1992-10-01), MIAMI US, pages 47 - 49, XP000310155
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