SOLDERING DEVICE EQUIPPED WITH DECOMPOSITION MECHANISM, AND DECOMPOSITION METHOD

WIPO Patent Application WO/2015/064166

A1

Provided are a soldering device and a decomposition method with which formic acid can be processed safely and quickly, corrosion of a vacuum pump does not occur, and the exhaust speed and the degree of vacuum in the vacuum chamber can be ensured. This soldering device is equipped with a decomposition mechanism that decomposes a reducing agent included in exhaust gas exhausted from a vacuum chamber. The decomposition mechanism has, in an exhaust passage connecting the vacuum chamber (10) and a vacuum pump (11), a flow path (16) having a catalytic layer (15), a bypass passage (12), and a gas introduction mechanism (13) that introduces oxygen or an oxygen-containing gas into the catalytic layer (15). In a method for decomposing the reducing agent, the exhaust gas exhausted from the vacuum chamber (10) is passed only through the catalytic layer (15) together with oxygen or oxygen-containing gas, thereby reducing the concentration of the reducing agent, after which the bypass passage (12) is opened and the interior of the vacuum chamber (10) is brought to vacuum, and the reducing agent undergoes decomposition in a second catalytic layer (7).

OZAWA NAOTO (JP)
SUZUKI TAKAYUKI (JP)
MATSUZUKI YUTAKA (JP)

PCT/JP2014/070455

May 07, 2015

August 04, 2014

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ORIGIN ELECTRIC (JP)

B23K3/08; B23K1/008; B23K31/02; H01L21/60; H05K3/34; B23K101/40

JP2011067864A	2011-04-07
JP2012028589A	2012-02-09
JPH11233934A	1999-08-27
JP2001244618A	2001-09-07
JP2011121102A	2011-06-23
JPH04220166A	1992-08-11
JPS5168988A	1976-06-15
JPS55104634A	1980-08-11
US3685139A	1972-08-22
US3752642A	1973-08-14

NAKAYAMA, Mitsuko (JP)
Nakayama Photon (JP)

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