Title:
SOLDERING DEVICE AND METHOD FOR MANAGING SOLDERING DEVICES
Document Type and Number:
WIPO Patent Application WO/2010/116664
Kind Code:
A1
Abstract:
A solder bath, inside which a primary jet nozzle and a secondary jet nozzle are disposed, is filled with molten Sn-Ag-Cu solder; the primary jet nozzle spouts molten solder in a disturbed state and the secondary jet nozzle spouts molten solder in a placid state, causing tiny pieces of tin oxide to float to the surface of the molten solder. By reducing the formation of solder dross, which forms when molten solder gets bound up with tin oxide, this increases the solder utilization rate.
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Inventors:
KAWASHIMA YASUJI
Application Number:
PCT/JP2010/002249
Publication Date:
October 14, 2010
Filing Date:
March 29, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
KAWASHIMA YASUJI
KAWASHIMA YASUJI
International Classes:
B23K3/06; B23K1/08; H05K3/34; B23K101/42
Foreign References:
| JP2003033869A | 2003-02-04 | |||
| JP2007038257A | 2007-02-15 | |||
| JP2002331360A | 2002-11-19 |
Attorney, Agent or Firm:
NAITO, Hiroki et al. (JP)
Hiroki Naito (JP)
Hiroki Naito (JP)
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