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Patent Searching and Data


Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/049187
Kind Code:
A1
Abstract:
Disclosed are a soldering device and soldering method whereby it is possible to can solder a tab lead to a solar battery cell in a short time without damaging the solar cell. The soldering device (100), which is used to solder a tab lead (15) to a solar cell (10), is equipped with: a preheating section (60) which, with the solar cell (10) and the tab lead (15) overlapping, heats the solar cell (10) and the tab lead (15) to a temperature not greater than the solder melting point; and a soldering section (70) which heats the overlapping section of the solar cell (10) and the tab lead (15) to a temperature above the solder melting point.

Inventors:
ISHIKAWA AKIHIKO (JP)
KATAYAMA MANABU (JP)
KASAHARA MASATO (JP)
ISHIHARA KAZUSHIGE (JP)
Application Number:
PCT/JP2010/068651
Publication Date:
April 28, 2011
Filing Date:
October 15, 2010
Export Citation:
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Assignee:
NISSHINBO MECHATRONICS INC (JP)
NISSHINBO ALPS TECH CO LTD (JP)
ISHIKAWA AKIHIKO (JP)
KATAYAMA MANABU (JP)
KASAHARA MASATO (JP)
ISHIHARA KAZUSHIGE (JP)
International Classes:
B23K1/00; B23K3/00; B23K3/04; B23K31/02; H01L31/042; B23K101/36
Foreign References:
JP2009152266A2009-07-09
JP2008053625A2008-03-06
JP2006147902A2006-06-08
JP2006310745A2006-11-09
JP2004363293A2004-12-24
JP2008258267A2008-10-23
JP2005235971A2005-09-02
JP2006147887A2006-06-08
JP2006066570A2006-03-09
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