Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/049187
Kind Code:
A1
Abstract:
Disclosed are a soldering device and soldering method whereby it is possible to can solder a tab lead to a solar battery cell in a short time without damaging the solar cell. The soldering device (100), which is used to solder a tab lead (15) to a solar cell (10), is equipped with: a preheating section (60) which, with the solar cell (10) and the tab lead (15) overlapping, heats the solar cell (10) and the tab lead (15) to a temperature not greater than the solder melting point; and a soldering section (70) which heats the overlapping section of the solar cell (10) and the tab lead (15) to a temperature above the solder melting point.
Inventors:
ISHIKAWA AKIHIKO (JP)
KATAYAMA MANABU (JP)
KASAHARA MASATO (JP)
ISHIHARA KAZUSHIGE (JP)
KATAYAMA MANABU (JP)
KASAHARA MASATO (JP)
ISHIHARA KAZUSHIGE (JP)
Application Number:
PCT/JP2010/068651
Publication Date:
April 28, 2011
Filing Date:
October 15, 2010
Export Citation:
Assignee:
NISSHINBO MECHATRONICS INC (JP)
NISSHINBO ALPS TECH CO LTD (JP)
ISHIKAWA AKIHIKO (JP)
KATAYAMA MANABU (JP)
KASAHARA MASATO (JP)
ISHIHARA KAZUSHIGE (JP)
NISSHINBO ALPS TECH CO LTD (JP)
ISHIKAWA AKIHIKO (JP)
KATAYAMA MANABU (JP)
KASAHARA MASATO (JP)
ISHIHARA KAZUSHIGE (JP)
International Classes:
B23K1/00; B23K3/00; B23K3/04; B23K31/02; H01L31/042; B23K101/36
Foreign References:
JP2009152266A | 2009-07-09 | |||
JP2008053625A | 2008-03-06 | |||
JP2006147902A | 2006-06-08 | |||
JP2006310745A | 2006-11-09 | |||
JP2004363293A | 2004-12-24 | |||
JP2008258267A | 2008-10-23 | |||
JP2005235971A | 2005-09-02 | |||
JP2006147887A | 2006-06-08 | |||
JP2006066570A | 2006-03-09 |
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