Title:
SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/153017
Kind Code:
A1
Abstract:
A soldering device (A) comprising a soldering tip (5) which is heatable and which has a substantially cylindrical shape extending vertically, and solder-piece supplying units (2, 6) that supply a solder piece (Wh) from above into the inside of the soldering tip (5), wherein the solder piece (Wh) is melted using the heat of the soldering tip (5) and the melted solder is supplied downwardly. The device is configured to bring a supplied solder piece (Wh) forcedly into contact with the inner wall of the soldering tip (5). Thus, a solder piece (Wh) can be more reliably heated and melted using the heat of the soldering tip (5).
Inventors:
EBISAWA MITSUO (JP)
Application Number:
PCT/JP2016/059543
Publication Date:
September 29, 2016
Filing Date:
March 25, 2016
Export Citation:
Assignee:
AND CO LTD (JP)
International Classes:
B23K3/02; B23K1/00; B23K3/06; H05K3/34; B23K101/42
Foreign References:
| JP2016059927A | 2016-04-25 | |||
| JP2015076496A | 2015-04-20 | |||
| JP2013077840A | 2013-04-25 | |||
| JP2009195938A | 2009-09-03 | |||
| JP2009200196A | 2009-09-03 | |||
| JPH0518755U | 1993-03-09 | |||
| JPS5555268U | 1980-04-14 | |||
| JPS5053434U | 1975-05-22 | |||
| US20110168762A1 | 2011-07-14 |
Other References:
See also references of EP 3275584A4
Attorney, Agent or Firm:
YAMADA, SHIGEKI (JP)
Shigeki Yamada (JP)
Shigeki Yamada (JP)
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