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Title:
SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/054619
Kind Code:
A1
Abstract:
A soldering device 10 for soldering a terminal 110 of an electronic component into a land 102 provided in a through hole 101 in a substrate 100, is provided with auxiliary heat sources 16, 17 that locally heat the land 102 and the terminal 110 in advance of execution of soldering.

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Inventors:
MIYAHARA EICHIRO (JP)
YAMADA HIDENORI (JP)
KONDO TOSHIICHI (JP)
Application Number:
PCT/JP2019/035220
Publication Date:
March 19, 2020
Filing Date:
September 06, 2019
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
B23K31/02; B23K1/00; B23K3/00; H05K3/34
Foreign References:
JP2005322806A2005-11-17
JP2007073661A2007-03-22
JP2014146630A2014-08-14
JPS61156896A1986-07-16
JP2012134269A2012-07-12
JP2018019029A2018-02-01
Attorney, Agent or Firm:
SATO INTERNATIONAL PATENT FIRM (JP)
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