Title:
SOLDERING FLUX AND SOLDER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/191121
Kind Code:
A1
Abstract:
Provided is a soldering flux that improves shape retention during printing, that is capable of suppressing heat sagging, and that has high electrical reliability between conductors. A soldering flux containing an epoxy resin, an organic carboxylic acid, and a linear-structure plastic as a heat-resistant shape-retention agent, wherein the epoxy resin and the organic carboxylic acid are blended such that the equivalent of the carboxyl group in the organic carboxylic acid is 0.8-2.0 in relation to 1.0 equivalent of the epoxy group in the epoxy resin, and the epoxy resin, the organic carboxylic acid, and the linear-structure plastic are included as a total at no less than 70 mass% with respect to the total amount of flux.
Inventors:
GANBE TATSUYA (JP)
OKAMOTO KENJI (JP)
OKAMOTO KENJI (JP)
Application Number:
PCT/JP2013/066553
Publication Date:
December 27, 2013
Filing Date:
June 17, 2013
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
FUJI ELEC FA COMPONENTS & SYS (JP)
FUJI ELEC FA COMPONENTS & SYS (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Domestic Patent References:
| WO2011033743A1 | 2011-03-24 |
Foreign References:
| JP2002239785A | 2002-08-28 | |||
| JP2003103398A | 2003-04-08 | |||
| JP2008012576A | 2008-01-24 |
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (JP)
Okuyama In addition, it is 1. (JP)
Okuyama In addition, it is 1. (JP)
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