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Patent Searching and Data


Title:
SOLDERING IRON, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS BY USING IT, AMD MANUFACTURING EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2008/023461
Kind Code:
A1
Abstract:
A soldering iron which prevents scattering of flux and is not likely to clog, and a process of soldering an electronic apparatus in which the amount of solder fed at a time for soldering is made constant and soldering is performed well. The soldering iron is characterized by comprising a cutting blade (52) which can advance/retreat in one direction depending on an output from a drive source and has a solder holding hole penetrating in the direction intersecting the advance/retreat direction perpendicularly to allow thread solder to pass, a receiving blade (51) having a recess for guiding the cutting blade in the advance/retreat direction and provided, on one side thereof, with a solder supply hole which is aligned with the through hole during retreat of the cutting blade and, on the same side or the opposite side thereof, with a solder discharge hole which is aligned with the through hole during advance of the cutting blade, a tube (9) that is disposed such that the radial position is aligned with the solder discharge hole and that has the opposite open ends, the inside diameter permitting passage of thread solder, and at least an inner surface at the tip portion being formed of a material exhibiting low wettability to solder, and a heating means (8) for melting solder at the tip thereof.

Inventors:
EBISAWA MITSUO (JP)
Application Number:
PCT/JP2007/000884
Publication Date:
February 28, 2008
Filing Date:
August 20, 2007
Export Citation:
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Assignee:
EBISAWA MITSUO (JP)
International Classes:
B23K3/02; B23K3/06; H05K3/34; B23K101/42
Foreign References:
JPH11245029A1999-09-14
JP2001203446A2001-07-27
JPS62270272A1987-11-24
JPS59141370A1984-08-14
JPH0253873U1990-04-18
JPS58125640U1983-08-26
Attorney, Agent or Firm:
YANO, Masayuki (9 Takeda Tobadonocho,Fushimi-ku, Kyoto-sh, Kyoto 50, JP)
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