SOLDERING MATERIAL, SOLDERED JOINT, AND METHOD FOR INSPECTING SOLDERING MATERIAL

Title:

SOLDERING MATERIAL, SOLDERED JOINT, AND METHOD FOR INSPECTING SOLDERING MATERIAL

Document Type and Number:

WIPO Patent Application WO/2017/002704

Kind Code:

A1

Abstract:

The present invention accurately distinguishes a soldering material which is less apt to oxidize. The soldering material is Cu-core balls which comprise: Cu balls that have a given size and ensure a space between a semiconductor package and a printed board; and a solder layer with which each Cu ball has been coated. After a 72-hour burning test in a 150ºC thermostatic chamber inside a room having a temperature of 25ºC and a humidity of 40%, the Cu-core balls have a lightness according to the L*a*b* color system of 62.5 or greater. Before the burning test, the soldering material has a lightness according to the L*a*b* color system of 65 or greater and a yellowness according to the L*a*b* color system of 7.0 or less.

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Inventors:

KAWASAKI HIROYOSHI (JP)
NISHINO TOMOAKI (JP)
ROPPONGI TAKAHIRO (JP)
SATO ISAMU (JP)
KAWAMATA YUJI (JP)

Application Number:

PCT/JP2016/068673

Publication Date:

January 05, 2017

Filing Date:

June 23, 2016

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B23K35/26; B22F1/00; B22F1/065; B22F1/102; B22F1/142; B22F1/17; B22F1/18; H01L21/60; H05K3/34; C22C13/00

Domestic Patent References:

WO2009090776A1	2009-07-23
WO2012118202A1	2012-09-07
WO2014109052A1	2014-07-17

Foreign References:

JP5590259B1	2014-09-17
JP5585751B1	2014-09-10

Other References: