Title:
SOLDERING METHOD, SEMICONDUCTOR MODULE MANUFACTURING METHOD AND SOLDERING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/074835
Kind Code:
A1
Abstract:
A soldering method for soldering an electronic component on a circuit board is provided.
In the soldering method, a cooling circuit board is used as the circuit board.
The cooling circuit board includes an insulating board having a metal circuit
on the surface, and a metal heat sink which is fixed on the rear plane of the insulating
board and has a cooling medium flow path. On the metal circuit, the electronic
component is arranged through a solder. At the time of melting the solder with
heat, a heated heating medium is permitted to flow in the cooling medium flow path.
Inventors:
KIMBARA MASAHIKO (JP)
Application Number:
PCT/JP2006/325944
Publication Date:
July 05, 2007
Filing Date:
December 26, 2006
Export Citation:
Assignee:
TOYOTA JIDOSHOKKI KK (JP)
KIMBARA MASAHIKO (JP)
KIMBARA MASAHIKO (JP)
International Classes:
H05K3/34; B23K1/00; B23K3/04
Foreign References:
| JPS5486457A | 1979-07-10 | |||
| JPH10178268A | 1998-06-30 | |||
| JPH08340177A | 1996-12-24 | |||
| JP2001257458A | 2001-09-21 | |||
| JP2001339152A | 2001-12-07 | |||
| JPH08293668A | 1996-11-05 | |||
| JPS62257737A | 1987-11-10 |
Attorney, Agent or Firm:
ONDA, Hironori (Ohmiya-cho 2-chome Gifu-sh, Gifu 31, JP)
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