Title:
SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2005/077583
Kind Code:
A1
Abstract:
Disclosed is a method enabling soldering with good quality. The pressure in a vacuum chamber (2), wherein an object (10) with a solid solder containing tin only or tin and one or more components selected from silver, lead, copper, bismuth, indium and zinc is placed, is reduced to vacuum conditions. After removing the oxide film of the solder by generating a free radical gas, generation of the free radical gas is stopped and the temperature is increased to the melting point of the solder or higher in a non-oxidizing atmosphere, thereby melting the solder.
Inventors:
OHNO YASUHIDE (JP)
NAKAMORI TAKASHI (JP)
SUENAGA MAKOTO (JP)
TAKEUCHI TATSUYA (JP)
KAGAMI JOHJI (JP)
HAGIHARA TAIZO (JP)
NAKAMORI TAKASHI (JP)
SUENAGA MAKOTO (JP)
TAKEUCHI TATSUYA (JP)
KAGAMI JOHJI (JP)
HAGIHARA TAIZO (JP)
Application Number:
PCT/JP2005/002324
Publication Date:
August 25, 2005
Filing Date:
February 16, 2005
Export Citation:
Assignee:
SHINKO SEIKI COMPANY LTD (JP)
OHNO YASUHIDE (JP)
NAKAMORI TAKASHI (JP)
SUENAGA MAKOTO (JP)
TAKEUCHI TATSUYA (JP)
KAGAMI JOHJI (JP)
HAGIHARA TAIZO (JP)
OHNO YASUHIDE (JP)
NAKAMORI TAKASHI (JP)
SUENAGA MAKOTO (JP)
TAKEUCHI TATSUYA (JP)
KAGAMI JOHJI (JP)
HAGIHARA TAIZO (JP)
International Classes:
B23K1/20; B23K1/008; B23K3/08; B23K31/02; B23K35/26; C22C13/00; H05K3/34; (IPC1-7): B23K1/20
Foreign References:
| JPS59225880A | 1984-12-18 | |||
| JPH02190489A | 1990-07-26 |
Attorney, Agent or Firm:
Kimura, Masatoshi (7th Floor Shin-crescent Building, 72 Kyomachi,
Chuo-ku, Kobe-sh, Hyogo 34, JP)
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