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Title:
SOLDERING MOUNTING STRUCTURE, PRODUCTION METHOD AND DEVICE FOR THE SAME, ELECTRONIC APPARATUS, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2007/074594
Kind Code:
A1
Abstract:
A camera module structure (100) has a structure where a camera module (2) susceptible to heat is joined to a printed wiring board (1) with a solder joint section (3) in between them. A through-hole (11) is formed in the printed wiring board (1), and a terminal (12) is formed on the board so as to close a surface opening formed by the through-hole (11) in a mounting surface of the printed wiring board (1). The solder joint section (3) is provided on the terminal (12). The solder joint section (3) is formed by heating by light (heat ray) applied from the rear side of the printed wiring board (1) by way of the terminal (12) on the printed wiring board (1), so that heat is not transmitted to the camera module (2). Accordingly, the camera module structure (100) mounted on the printed wiring board (1) is obtained without the camera module (2), susceptible to heat, being damaged by heat.

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JPS61234057IC PACKAGE
JP6780523Surface mount interposers and electronic devices
Inventors:
NISHIDA KATSUITSU
KINOSHITA KAZUO
Application Number:
PCT/JP2006/323093
Publication Date:
July 05, 2007
Filing Date:
November 20, 2006
Export Citation:
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Assignee:
SHARP KK (JP)
NISHIDA KATSUITSU
KINOSHITA KAZUO
International Classes:
H05K1/02; H05K3/34; H05K1/18
Foreign References:
JPH0951016A1997-02-18
JPH10214859A1998-08-11
JP2005158948A2005-06-16
JPS6350169U1988-04-05
JPH07263494A1995-10-13
JPH1041360A1998-02-13
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kit, Kita-ku Osaka-shi Osaka 41, JP)
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