Title:
SOLDERING SYSTEM, AND DEVICE AND ROBOT USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/034613
Kind Code:
A1
Abstract:
A soldering system (1) comprises: a display image creation function (2) that reads an actual substrate and creates a display image of the substrate; an object creation function (3) that creates an object, which is an image when the display image is mounted on an actual soldering jig; and a program creation function (4) that creates a program in which a soldering position, soldering attribute, and soldering route are specified for the object, wherein the display image creation function includes an image reading unit and an inclination correction unit, the object creation function includes an imposition information acquisition unit, and the program creation function includes a soldering position acquisition unit, a soldering attribute acquisition unit, and a route display unit.
Inventors:
SAITO KAZUAKI (JP)
NINOMIYA SEIJI (JP)
YAMASHITA HIDEAKI (JP)
NINOMIYA SEIJI (JP)
YAMASHITA HIDEAKI (JP)
Application Number:
PCT/JP2023/028963
Publication Date:
February 15, 2024
Filing Date:
August 08, 2023
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
B23K3/00; B23K3/08; G05B19/4093
Domestic Patent References:
| WO2022065437A1 | 2022-03-31 |
Foreign References:
| JP2018114524A | 2018-07-26 | |||
| JP2005322806A | 2005-11-17 | |||
| JP2002110725A | 2002-04-12 | |||
| JP2014195827A | 2014-10-16 |
Attorney, Agent or Firm:
ARAI, Shigeto (JP)
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