CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. application number 62/742,956 filed October 9, 2018, the entire contents of which are hereby incorporated by reference in its entirety.

TECHNICAL FIELD

Example embodiments generally relate to soldering tools and, in particular, relate to such a tool having an integrated camera to enable visual inspection of soldering joints using image and/or video data.

BACKGROUND

Soldering tools, which are sometimes referred to as soldering irons or soldering guns, are commonly used in electronics manufacturing and repair activities along with other crafts and industries that involve metalwork. Soldering tools are typically used to join metallic items together at a joint by melting a filler metal (i.e., solder) into the joint. The solder has a lower melting point than the items being joined together at the joint, so the soldering tool needs to apply heat sufficient to melt the solder, but not hot enough to melt the items being joined.

Although a number of soldering tool designs have been proposed, a basic soldering tool design includes at least a tip portion that is operably coupled to a heater. The tip portion may, due to operation of the heater, become hot enough to melt the solder that contacts the tip portion. The tip portion may, in some cases, be removable/interchangeable so that a number of different geometries (e.g., sizes and/or shapes) of tips or bits can be substituted for respective different jobs. For example, some tip geometries (or shapes) may include a fine conical tip, a tapered chisel tip, a pyramid tip, a triangular flat face tip, a wide flat face tip, etc., where different sizes may further be available within each respective shape category.

For a typical soldering job, the operator of the tool will utilize the soldering tool to form a soldering joint and then visually inspect the joint and/or have a supervisor or colleague do the same to ensure that the soldering joint is satisfactory. While a skilled craftsman is often the best judge as to whether the soldering joint meets quality standards, the performance of inspections in this way can add time delays to certain jobs, or may not be possible in a timely fashion under certain circumstances. Accordingly, it may be preferable to introduce improvements to the way in which soldering joints can be inspected. BRIEF SUMMARY OF SOME EXAMPLES

Some example embodiments may enable the provision of methods and devices that enable a soldering joint to be visually inspected via a camera integrated into the soldering tool.

In an example embodiment, a soldering tool may be provided. The soldering tool may include a power unit including a controller, a tool body configured to interface with the power unit, and a tip portion operably coupled to the tool body. The tool portion includes a tip that is heated to melt solder by a heating element under control of the controller. The soldering tool is operably coupled to a display configured to display a captured image of a solder joint formed proximate to the tip. The captured image is provided for comparison to a reference image stored in an image database to evaluate the solder joint.

In another example embodiment, a soldering tool may be provided. The soldering tool may include a power unit comprising a controller, a tool body configured to interface with the power unit, a tip portion operably coupled to the tool body and including a tip that is heated to melt solder by a heating element under control of the controller, and a camera. The camera may be integrated into the tip portion or the tool body and configured to generate a captured image of a solder joint formed proximate to the tip. The captured image may be displayed during operation of the soldering tool.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

Having thus described some example embodiments in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

FIG. 1 illustrates a soldering tool structure that may be useful in connection with providing an integrated camera for a soldering tool according to an example embodiment;

FIG. 2 illustrates a block diagram of the soldering tool having an integrated camera according to an example embodiment;

FIG. 3 illustrates a conceptual block diagram of various components associated with a either a power unit of the soldering tool or a remote device in accordance with an example embodiment;

FIG. 4 illustrates a method of evaluating image data associated with a soldering joint in accordance with an example embodiment; and

FIG. 5 illustrates another method of evaluating image data associated with a soldering joint in accordance with an example embodiment. DETAILED DESCRIPTION

Some example embodiments now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all example embodiments are shown. Indeed, the examples described and pictured herein should not be construed as being limiting as to the scope, applicability or configuration of the present disclosure. Rather, these example embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference numerals refer to like elements throughout. Furthermore, as used herein, the term“or” is to be interpreted as a logical operator that results in true whenever one or more of its operands are true. As used herein, operable coupling should be understood to relate to direct or indirect connection that, in either case, enables functional interconnection of components that are operably coupled to each other.

As indicated above, some example embodiments may relate to the provision of a soldering tool that includes the ability to visually inspect a soldering joint using an integrated camera. The integration of a camera into the soldering tool may be accomplished either by integrating the camera into the soldering tip or the handle. In either case, the camera may send images to a base or power unit of the soldering tool to enable visual inspection of the soldering joint in real time. In some cases, the images (or video) may also (or alternatively) be provided to a remote viewing device (e.g., a laptop, personal computer, user terminal, or other device capable of displaying image or video data). Accordingly, even remote viewing and evaluation of a soldering joint (either in real time or post hoc) may be accomplished.

FIG. 1 illustrates a soldering tool 100 according to an example embodiment. As shown in FIG. 1, the soldering tool 100 of an example embodiment may include a tip portion 110 that integrates a tip 112 (or bit) together with a handpiece 114 in a single structure. The tip 112 may extend forward of the handpiece 114, generally in line with a longitudinal axis of the tip portion 110. The handpiece 114 may have insulated grips disposed thereon on an external surface thereof. Internally, the handpiece 114 may include electronic components for interfacing with or otherwise driving operation of the soldering tool 100 with respect to providing power for heat generation at the tip 112.

In an example embodiment, the soldering tool 100 may also include a tool body 120 that is configured to support the tip portion 110 and, in some cases, electronics for interfacing with a heating element that heats the tip 112. In particular, the tool body 120 may include electronics (e.g., control circuitry) for directing operation of the components of the tip portion 110, and a power cord or cable 124 that operably couples the tool body 120 to a power unit 130. Thus, the power unit 130 may provide power and/or control signals to the tool body 120 via the cable 124. The power unit 130 may include a power supply and a controller (or microcontroller) that includes electronics for defining modes of operation and/or other control aspects associated with operation of the soldering tool 100. In some cases, the power unit 130 may provide a display 132 and one or more input devices (e.g., buttons, switches, touchscreen inputs, etc.) for interfacing with the power unit 130 (and the controller therein) to control operation of the soldering tool 100.

As shown in FIG. 1, the soldering tool 100 may further include a camera 140, which may be disposed either at the tip portion 110 or at the tool body 120. In an example embodiment, the camera 140 may be integrated into the tip portion 110 or the tool body 120 in order to minimize the possibility of damage to the camera 140. In some cases, the camera 140 may be a so called“nano camera” having a size of about 2.2 by 1 mm or less. The camera 140 may be oriented to focus a view of the camera 140 at or proximate to an end of the tip 112. Thus, for example, if the soldering tool 100 is used to form at soldering joint 150 on a printed circuit board (PCB) 152 or other medium, the camera 140 may be configured to generate image or video data (e.g., captured image 174) that may include one or more individual still images or video data in the form of moving images of the soldering joint 150. The camera 140 may be configured to generate enlarged images when generating the image or video data.

As can be appreciated from the description above, the electronics housed in the tool body 120, and the wiring or circuitry therein, may further include electronics, wiring or circuitry for supporting operation of the camera 140. Thus, for example, image or video data may also be communicated through the cable 124 to the power unit 130. Moreover, the display 132 on the power unit 132 may display the image or video data in real time for inspection by an operator of the soldering tool 100. As such, for example, the soldering joint 150 may be inspected for quality and evaluated accordingly. Moreover, the image or video data may be compared to image or video data that has been previously stored for supporting evaluation of the soldering joint 150 as described in greater detail below.

Although the image or video data captured by the camera 140 may be evaluated locally at the power unit 130, remote evaluation may also be possible in some cases. For example, the power unit 130 (or the tool body 120) may be operably coupled to a remote terminal 160 to communicate the image or video data captured by the camera 140 to the remote terminal 160. The operable coupling may be provided by a communication link 162, which may be either wired or wireless in some cases. Thus, for example, the communication link 162 may be provided an Ethernet cable, USB cable, or other wired connection, or may be provided by a WiFi, Bluetooth, or other wireless connection. The remote terminal 160 may be a laptop, personal computer, user terminal, cell phone, or other device. As such, for example, a remote viewer (e.g., a supervisor, instructor, colleague or other evaluator/viewer of the soldering joint 150) may be enabled to review the image or video data generated by the camera 140 of the soldering joint 150 either in real time or after the fact in order to evaluate or inspect the soldering joint 150. Moreover, in some cases, one or both of the display 132 and the remote terminal 160 may be configured to display a reference image 172 to which a captured image 174 of the image or video data captured by the camera 140 can be compared to facilitate the evaluation or inspection.

The captured image 174 may be obtained in a number of different ways. In some cases, an actuator 176 may be provided at the camera 140 or at a portion of the tool body 120. For example, in some cases, the actuator 176 may be provided at the handpiece 114 so that the user can press the actuator 176 (e.g., a button) to cause the camera 140 to take a picture and obtain the captured image 174. Alternatively, the actuator 176 can turn the camera 140 on or off to start or stop video recording. In some cases, any image or video data generated in this way may automatically be communicated to the power unit 130 and/or the remote unit 160 in real time. Alternatively, the image or video data may be stored for later evaluation by the operator or an inspector. In some cases, the operator or inspector may therefore be enabled to see live image or video data generated by the camera 140 and comment on the same, or otherwise make visual inspections or monitor the formation of the soldering joint 150. However, in some cases, no actuator 176 need be provided at the tool body 120. Instead, the actuation of the camera 140 may be conducted remotely (e.g., at the power unit 130 or the remote device 160), or the camera 140 may simply always be on and always be communicating image or video data to the power unit 130 and/or the remote device 160.

FIG. 2 illustrates a block diagram of various components of the soldering tool 100 in accordance with an example embodiment. Referring now to FIG. 2, the power unit 130 may include processing circuitry 200 including or otherwise embodied as a controller of the power unit 130. The processing circuitry 200 may be configured to perform data processing, control function execution and/or other processing and management services for the power unit 130 specifically, and other portions of the soldering tool 100 generally, according to an example embodiment. In some embodiments, the processing circuitry 200 may be embodied as a chip or chip set. In other words, the processing circuitry 200 may comprise one or more physical packages (e.g., chips) including materials, components and/or wires on a structural assembly (e.g., a baseboard). In an example embodiment, the processing circuitry 200 may include one or more instances of a processor and memory that may be in communication with or otherwise control a various components to which the processing circuitry 200 is operably coupled (e.g., the tool body 120, the tip portion 110, the camera 140, the remote terminal 160, and components thereof).

The power unit 130 may also include a power supply 180, which may include transformers, rectifiers and/or any other circuitry configured to condition power provided from mains power or any other suitable source to the voltage and/or current desirable for provision to a heating element of the soldering tool 100 to cause heat to be generated at the heating element in the tip 112. The power supply 180 may operate under control of the processing circuitry 200 to generate the desired voltages and/or currents. In some embodiments, the voltages and/or currents may be set to standard levels or settings that are associated with a mode of operation that can be selected by the operator at the power unit 130. In some embodiments, the power unit 130 may be operably coupled to the remote terminal 160, and the remote terminal 160 may also include an instance of processing circuitry 200’. The processing circuitry 200’ may be similar in function (and in some cases form) to the processing circuitry 200 of the power unit 130.

FIG. 3 illustrates a block diagram of the processing circuitry 200/200’ of either the power unit 130 or the remote terminal 160 interacting with various components or modules to facilitate image processing in accordance with an example embodiment. In this regard, as shown in FIG. 3, the processing circuitry 200/200’ may provide the hardware that is programmed or that hosts software to configure the system for enabling image data viewing and analysis as described herein. In this regard, the processing circuitry 200/200’ may be configured to perform data processing, control function execution and/or other processing and management services according to an example embodiment of the present invention. In some embodiments, the processing circuitry 200/200’ may be embodied as a chip or chip set. In other words, the processing circuitry 200/200’ 220 may comprise one or more physical packages (e.g., chips) including materials, components and/or wires on a structural assembly (e.g., a baseboard).

In an example embodiment, the processing circuitry 200/200’ may include one or more instances of a processor 222 and memory 224 that may be in communication with or otherwise control a device interface 240 and a user interface 250. As such, the processing circuitry 200/200’ may be embodied as a circuit chip (e.g., an integrated circuit chip) configured (e.g., with hardware, software or a combination of hardware and software) to perform operations described herein. The user interface 250 may be in communication with the processing circuitry 200/200’ (directly or via the device interface 240) to receive an indication of a user input at the user interface 250 and/or to provide an audible, visual, mechanical or other output to the user. As such, the user interface 250 may include, for example, a display, one or more buttons or keys (e.g., function buttons), and/or other input/output mechanisms (e.g., keyboard, microphone, speakers, cursor, joystick, lights and/or the like). The user interface 250 may display or otherwise provide an output of image data and/or video data captured by the camera 140. Moreover, the user interface 250 may also be operably coupled (e.g., via the device interface 240) to an image database 260 that stores image data of soldering joints that have been previously designated as reference images (e.g., the reference image 172) to be used for evaluation of image or video data captured by the camera 140. In this regard, for example, the image database 260 may be populated with images of satisfactory or high quality soldering joints that can be compared to a real time (or post hoc) image or video data generated based on the soldering joint 150 that is captured by the camera 140. The operator, or another inspector, may compare the reference image 172 to the captured image 174 on the user interface 250 (e.g., display 132 or remote terminal 160) to enable or otherwise make a determine regarding the soldering joint 150.

In an example embodiment, the captured image 174 may be compared to the reference image 172 to initially determine a closest match to, for example, try to match the context around the soldering joint 150 or otherwise try to obtain the reference image 172 that is best suited for comparison to the captured image 174. However, in other cases, the operator or inspector may select the reference image 172 that is to be used. In some cases, a visual inspection of the captured image 174 may be made based on a visual side-by-side comparison of the captured image 174 to the reference image 172. In such cases, the operator or inspector may make a determination regarding the quality of the soldering joint 150 and provide an input into the user interface 250 to communicate or record an assessment of the soldering joint 150 (e.g., via a message to the operator at the user interface 250 of the power unit 130). For example the operator or inspector may give the soldering joint 150 a pass or fail rating, so that if a fail rating is issued, the soldering joint 150 should be replaced with a new soldering joint 150. In some cases, the operator or inspector may update the image database 260 to include the soldering joint 150 if, for example, the soldering joint 150 is judged to be of high quality or otherwise considered worthy of inclusion in the image database 260.

In some cases, the processing circuitry 200/200’ may be enabled to make an automated comparison of the captured image 174 to the reference image 172. In such examples, the processing circuitry 200/200’ may be configured to scale the captured image 174 to the reference image 172 and then conduct a point by point comparison over features predefined as features upon which quality of the soldering joint 150 may be judged. Based on analysis of the processing circuitry 200/200’, a message may be sent to the operator (e.g., at the user interface 250 of the power unit 130). The message may indicate that the soldering joint 150 passes or fails, or may otherwise provide other feedback to the operator.

The device interface 240 may include one or more interface mechanisms for enabling communication with the various internal and/or external devices of the soldering tool 100. Thus, for example, the device interface 240 may handle routing of communications between the power unit 130, the tool body 120, and/or the remote device 160. In some cases, the device interface 240 may be any means such as a device or circuitry embodied in either hardware, or a combination of hardware and software that is configured to receive and/or transmit data from/to devices in communication with the processing circuitry 200/200’. In some cases, the device interface 240 may include one or more ports for external component connectivity and/or communication (e.g., Ethernet or wireless communications, and/or the like). Standard ports such as USB, other data ports, or power cable ports may be provided. However, in some cases, the ports may be for proprietary connectivity mechanisms. In some embodiments, the device interface 240 may include antennas, radio equipment and/or the like to enable the power unit 130 to interface with other components or devices (e.g., the remote terminal 160) wirelessly. Otherwise, wired communication, or combinations of wired and wireless communication, may be employed.

In an exemplary embodiment, the memory 224 may include one or more non-transitory memory devices such as, for example, volatile and/or non-volatile memory that may be either fixed or removable. The memory 224 may be configured to store information, data, applications, instructions or the like for enabling the processing circuitry 200/200’ to carry out various functions in accordance with exemplary embodiments of the present invention. For example, the memory 224 could be configured to buffer input data for processing by the processor 222. Additionally or alternatively, the memory 224 could be configured to store instructions for execution by the processor 222. As yet another alternative, the memory 224 may include one or more databases (e.g., image database 260) that may store a variety of data sets used for evaluation of the performance of the operator relative to making the soldering joint 150. Thus, in some cases, the memory 224 may store information associated with patterns, image data, feature vectors, histograms, processing algorithms and/or the like to be employed for inclusion in or the definition of image evaluation applications associated with the execution of example embodiments. Among the contents of the memory 224, applications (e.g., comparison or evaluation applications) may be stored for execution by the processing circuitry 200/200’ in order to carry out the functionality associated with each respective application. In some cases, the applications may include directions for control of the soldering tool 100, and/or instructions for guiding the operator relative to forming the soldering joint 150. In other cases, the applications may include instructions for conducting evaluation of the soldering joint 150 either by enabling visual inspection locally or remotely in real time or by performing automated soldering joint evaluation as described herein. Other applications stored in the memory 224 may facilitate the generation of feedback to the operator, and still other applications stored in the memory 224 may facilitate management of updating of the evaluation applications. Thus, for example, the memory 224 may also store applications that include directions for enabling authorized personnel to make updates to the image database 260 or updates to evaluation algorithms, feedback messaging, etc.

The processor 222 may be embodied in a number of different ways. For example, the processor 222 may be embodied as various processing means such as one or more of a microprocessor or other processing element, a coprocessor, a controller or various other computing or processing devices including integrated circuits such as, for example, an ASIC (application specific integrated circuit), an FPGA (field programmable gate array), or the like. In an example embodiment, the processor 222 may be configured to execute instructions stored in the memory 224 or otherwise accessible to the processor 222. As such, whether configured by hardware or by a combination of hardware and software, the processor 222 may represent an entity (e.g., physically embodied in circuitry - in the form of processing circuitry 200/200’) capable of performing operations according to embodiments of the present invention while configured accordingly. Thus, for example, when the processor 222 is embodied as an ASIC, FPGA or the like, the processor 222 may be specifically configured hardware for conducting the operations described herein. Alternatively, as another example, when the processor 222 is embodied as an executor of software instructions, the instructions may specifically configure the processor 222 to perform the operations described herein.

In an example embodiment, the processor 222 (or the processing circuitry 200/200’) may be embodied as, include or otherwise control the power unit 130 or the remote terminal 160 (or components thereof). As such, in some embodiments, the processor 222 (or the processing circuitry 200/200’) may be said to cause each of the operations described in connection with the power unit 130 or the remote terminal 160 (or components thereof) by directing the power unit 130 or the remote terminal 160 (or respective components) to undertake the corresponding functionalities responsive to execution of instructions or algorithms configuring the processor 222 (or processing circuitry 200/200’) accordingly.

FIG. 4 illustrates a method of evaluating a soldering joint formed by use of a soldering tool in accordance with an example embodiment. The method may include obtaining image or video data of a soldering joint from a camera integrated into a soldering tool during operation of the soldering tool at operation 400. The method may further include displaying the image or video data obtained to an operator of the soldering tool at operation 410 and providing a reference image along with a captured image associated with the image or video data obtained at operation 420. Within the context of the method described above, it should be appreciated that the display of the image or video data may be conducted in real time, and may be performed either at the power unit 130 (or other base) of the soldering tool 100, or at the remote terminal 160.

FIG. 5 illustrates another or an alternative method of evaluating a soldering joint formed by use of a soldering tool in accordance with an example embodiment. The method may include obtaining image or video data of a soldering joint from a camera integrated into a soldering tool during operation of the soldering tool at operation 500. The method may further include determining a reference image for comparison to a captured image associated with the image or video data obtained at operation 510. The method may further include evaluating (or receiving an evaluation of) a quality of the soldering joint based on the comparison at operation 520. The method may further include providing feedback to the operator based on the evaluation at operation 530. Within the context of the method described above, it should be appreciated that the provision of the reference image and captured image may be conducted in real time or post hoc, and the feedback may also be received in real time or post hoc. The analysis and feedback may be generated and/or received either at the power unit 130 (or other base) of the soldering tool 100, or at the remote terminal 160.

In an example embodiment, a soldering tool may therefore be provided. The soldering tool may include a power unit comprising a controller, a tool body configured to interface with the power unit, a tip portion operably coupled to the tool body and including a tip that is heated to melt solder by a heating element under control of the controller, and a camera. The camera may be integrated into the tip portion or the tool body and configured to generate a captured image of a solder joint formed proximate to the tip. The captured image may be displayed during operation of the soldering tool.

In some cases, the soldering tool described above may be augmented or modified by altering individual features mentioned above or adding optional features. The augmentations or modifications may be performed in any combination and in any order. For example, in some cases, the captured image may be displayed at a display provided at the power unit. In an example embodiment, the captured image may be displayed at a display provided at a remote device operably coupled to the soldering tool. In some cases, the remote device may be operably coupled to the soldering tool via a wireless connection. In an example embodiment, the remote device may be operably coupled to the soldering tool via a wired connection. In some cases, the captured image may be generated responsive to actuation of an actuator disposed at a handpiece of the tool body. In an example embodiment, the captured image may be compared to a reference image stored in an image database. The captured image and the reference image may be displayed next to each other to enable an evaluation of quality of the solder joint to be performed based on the comparison. In some cases, the captured image and the reference image are displayed in real time. In an example embodiment, the power unit or a remote terminal may include a display, and feedback regarding the quality of the solder joint may be provided to an operator of the soldering tool via the display of the power unit or the remote terminal.

According to an example embodiment, an alternative configuration or design for a soldering tool may be provided. The soldering tool may include a power unit including a controller, a tool body configured to interface with the power unit, and a tip portion operably coupled to the tool body. The tip portion may include a tip that is heated to melt solder by a heating element controlled by the controller. The soldering tool may be operably coupled to a display configured to display a captured image of a solder joint formed proximate to the tip, and the captured image may be provided for comparison to a reference image stored in an image database to evaluate the solder joint.

In some cases, the tool described above may be augmented or modified by altering individual features mentioned above or adding optional features. The augmentations or modifications may be performed in any combination and in any order. For example, in some cases, the image database may be disposed at the power unit, and the power unit comprises the display configured to display the captured image and the reference image. In an example embodiment, the captured image and the reference image may be displayed in real time. In some cases, the captured image may be generated responsive to actuation of an actuator disposed at a handpiece of the tool body. In an example embodiment, the image database may be disposed at a remote device operably coupled to the power unit, and the remote device may include the display configured to display the captured image and the reference image. In some cases, the captured image and the reference image may be displayed on the display in real time. In an example embodiment, the captured image may include still image or moving image data. In some cases, the reference image may be selected based on being a closest match to the solder joint. In an example embodiment, an evaluation of quality of the solder joint may be performed based on the comparison and the operator is provided with a message associated with the evaluation of quality. In some cases, the power unit or a remote terminal includes the display, and feedback regarding the quality of the solder joint may be provided to an operator of the soldering tool via the power unit or the remote terminal. In an example embodiment, the captured image may be generated by a camera integrated into the tool body or tip portion of the soldering tool.

Many modifications and other embodiments of the inventions set forth herein will come to mind to one skilled in the art to which these inventions pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the inventions are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Moreover, although the foregoing descriptions and the associated drawings describe exemplary embodiments in the context of certain exemplary combinations of elements and/or functions, it should be appreciated that different combinations of elements and/or functions may be provided by alternative embodiments without departing from the scope of the appended claims. In this regard, for example, different combinations of elements and/or functions than those explicitly described above are also contemplated as may be set forth in some of the appended claims. In cases where advantages, benefits or solutions to problems are described herein, it should be appreciated that such advantages, benefits and/or solutions may be applicable to some example embodiments, but not necessarily all example embodiments. Thus, any advantages, benefits or solutions described herein should not be thought of as being critical, required or essential to all embodiments or to that which is claimed herein. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.