SOLID POLYPROPYLENE-BASED RESIN COMPOSITION

Title:

SOLID POLYPROPYLENE-BASED RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2019/009389

Kind Code:

A1

Abstract:

A solid polypropylene-based resin composition which comprises 10-99.6 mass% polypropylene-based resin (A) having a melting endotherm (ΔH-D) of 0-80 J/g and 0.4-90 mass% additive (B) that is liquid at 23°C, the melting endotherm (ΔH-D) being obtained from a melting-endotherm curve obtained with a differential scanning calorimeter (DSC) by keeping a specimen in a nitrogen atmosphere at -10°C for 5 minutes and then heating the specimen at 10°C/min.

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Inventors:

OKAMOTO TAKUJI (JP)

Application Number:

PCT/JP2018/025621

Publication Date:

January 10, 2019

Filing Date:

July 06, 2018

Export Citation:

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Assignee:

IDEMITSU KOSAN CO (JP)

International Classes:

C08L23/10; C08K13/02

Foreign References:

JP2011052123A	2011-03-17
JP2011021137A	2011-02-03
JPS4824016B1	1973-07-18
JP2017071680A	2017-04-13
JPH08506612A	1996-07-16

Attorney, Agent or Firm:

HIRASAWA, Kenichi et al. (JP)

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