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Title:
SOLID SPHERE MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/1996/041699
Kind Code:
A1
Abstract:
A device for manufacturing solid spheres such as solder spheres having a high sphericity and a high dimensional accuracy without the necessity for classification of solid spheres. The device comprises a flat plate having a plurality of holes opened to and extending between upper and lower surface thereof, said upper surface being formed of a material, of which wettability is not good with a substance in a fused or semi-fused condition, a space filled with the substance in a fused or semi-fused condition, contacted with the lower surface and closed, a cylinder communicating with the space, a piston adapted to rise in the cylinder so that it pushes the substance in the space to force the same through the plurality of holes and jet the same onto the upper surface of the flat plate, and a drive device for moving the piston up and down, and makes use of surface tension of the jetted substance to form spheres.

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Inventors:
KAWAGUCHI TORANOSUKE (JP)
MAEZONO AKIKAZU (JP)
Application Number:
PCT/JP1996/001454
Publication Date:
December 27, 1996
Filing Date:
May 30, 1996
Export Citation:
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Assignee:
NIHON ALMIT CO LTD (JP)
KAWAGUCHI TORANOSUKE (JP)
MAEZONO AKIKAZU (JP)
International Classes:
B23K3/06; B22F1/065; B22F9/06; B23K35/02; B23K35/14; B23K35/40; H05K3/34; (IPC1-7): B23K35/40; B22F9/08
Foreign References:
JPH0523887A1993-02-02
JPH0466603A1992-03-03
JPS50102546A1975-08-13
Other References:
See also references of EP 0776726A4
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