Title:
SOLID-STATE IMAGE CAPTURE DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/039278
Kind Code:
A1
Abstract:
The present technique relates to a solid-state image capture device with which the number of terminals can be increased, a method for manufacturing the same, and an electronic apparatus. The solid-state image capture device is provided with: an image sensor substrate provided with a light reception region in which pixels for converting input light into an electric signal are arranged in a matrix; a solder ball which is disposed on the outside in the plane direction of the image sensor substrate and which outputs the electric signal; a glass substrate which is opposed to the image sensor substrate and the solder ball; and a through-electrode which connects a wiring pattern formed in the glass substrate and the solder ball through a glass adhesive resin inserted therebetween. The present disclosure may be applied in a package and the like provided with an image sensor substrate, for example.
Inventors:
NAGATA MASAYA (JP)
WAKIYAMA SATORU (JP)
WAKIYAMA SATORU (JP)
Application Number:
PCT/JP2018/029730
Publication Date:
February 28, 2019
Filing Date:
August 08, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/56; H01L23/12; H04N1/028; H04N5/369
Domestic Patent References:
| WO2014083750A1 | 2014-06-05 | |||
| WO2017135062A1 | 2017-08-10 |
Foreign References:
| JP2006216935A | 2006-08-17 | |||
| JP2013143520A | 2013-07-22 | |||
| JP2016001681A | 2016-01-07 | |||
| JP2016015406A | 2016-01-28 | |||
| JP2012114370A | 2012-06-14 | |||
| JP2000323616A | 2000-11-24 |
Other References:
See also references of EP 3675170A4
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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