Title:
SOLID-STATE IMAGE CAPTURE ELEMENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/130723
Kind Code:
A1
Abstract:
The present disclosure relates to a solid-state image capture element and an electronic device in which leakage of charge into adjacent pixels can be prevented.
A plurality of pixels performs photoelectric conversion with respect to light incident on a back surface via different on-chip lenses for the respective pixels. A pixel separation wall is formed between adjacent pixels, and comprises a front surface trench which is a trench formed on a front surface, and a back surface trench which is a trench formed on a back surface. The wiring layer is provided on the front surface. The present disclosure may be applied in a back-illuminated CMOS image sensor, for example.
Inventors:
MASAGAKI ATSUSHI (JP)
TANAKA YUSUKE (JP)
TANAKA YUSUKE (JP)
Application Number:
PCT/JP2017/000923
Publication Date:
August 03, 2017
Filing Date:
January 13, 2017
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; G02B7/34; H01L21/76; H04N5/369
Foreign References:
| US20120009720A1 | 2012-01-12 | |||
| JP2015065269A | 2015-04-09 | |||
| JP2015023259A | 2015-02-02 | |||
| JP2011082253A | 2011-04-21 | |||
| JP2012015160A | 2012-01-19 | |||
| JP2013080797A | 2013-05-02 | |||
| JP2014116472A | 2014-06-26 | |||
| JP2010239117A | 2010-10-21 | |||
| JP2010258157A | 2010-11-11 | |||
| JP2013175494A | 2013-09-05 | |||
| JP2009272597A | 2009-11-19 | |||
| JP2006086226A | 2006-03-30 |
Other References:
See also references of EP 3410487A4
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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