Title:
SOLID-STATE IMAGING APPARATUS AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/102278
Kind Code:
A1
Abstract:
Provided is a solid-state imaging apparatus that readily accommodates a design change of a pixel chip or a circuit chip. The present technology relates to a solid-state imaging apparatus comprising: a pixel chip including a pixel having a photoelectric conversion element; at least one circuit chip including a circuit for processing a signal generated in the pixel; and a connecting substrate electrically connecting the pixel chip and the circuit chip. In the solid-state imaging apparatus, the pixel chip, the connecting substrate, and the circuit chip are stacked in this order. The solid-state imaging apparatus of the present technology provides a solid-state imaging apparatus that readily accommodates a design change in a pixel chip or a circuit chip.
Inventors:
YOKOYAMA MASANAO (JP)
Application Number:
PCT/JP2021/036588
Publication Date:
May 19, 2022
Filing Date:
October 04, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L25/065; H01L21/822; H01L25/07; H01L25/18; H01L27/04; H01L27/146; H04N5/335; H04N5/369
Foreign References:
| JP2011078755A | 2011-04-21 | |||
| JP2009084299A | 2009-04-23 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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