Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/054491
Kind Code:
A1
Abstract:
The present invention provides a solid-state imaging device comprising: a semiconductor support substrate; a wiring layer formed on the semiconductor support substrate and including a predetermined metal wiring pattern; a photoelectric conversion layer provided on the wiring layer and including a plurality of photoelectric conversion elements formed in an array for generating charge by photoelectric conversion based on light incident on an incident surface; and reflecting structures which are disposed between the predetermined metal wiring pattern and the photoelectric conversion layer in correspondence with each of the plurality of photoelectric conversion elements, and which have a predetermined electromagnetic characteristic. The reflecting structures collect and reflect light incident on the photoelectric conversion layer that has passed through the photoelectric conversion elements of the photoelectric conversion layer toward the photoelectric conversion elements.
Inventors:
MORIMOTO RUI (JP)
Application Number:
PCT/JP2021/029562
Publication Date:
March 17, 2022
Filing Date:
August 10, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B5/26; G02B5/28; H01L31/0232; H04N5/369
Domestic Patent References:
| WO2018092632A1 | 2018-05-24 | |||
| WO2019102813A1 | 2019-05-31 |
Foreign References:
| JP2011091128A | 2011-05-06 | |||
| JP2013505587A | 2013-02-14 | |||
| JP2016517178A | 2016-06-09 | |||
| JP2014041921A | 2014-03-06 | |||
| JP2014027178A | 2014-02-06 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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