Title:
SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/018981
Kind Code:
A1
Abstract:
[Problem] To provide a solid-state imaging device in which a translucent member can be appropriately provided on a substrate including a photoelectric conversion unit. [Solution] This solid-state imaging device comprises: a substrate including a photoelectric conversion unit; a lens provided on the substrate; and a translucent member provided on the lens, wherein the translucent member includes a plurality of protruding sections provided on the upper surface of the translucent member in a two-dimensional array shape.
Inventors:
BABA TOMOHIKO (JP)
Application Number:
PCT/JP2021/021231
Publication Date:
January 27, 2022
Filing Date:
June 03, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B5/18; H01L27/146
Foreign References:
| JP2013038164A | 2013-02-21 | |||
| JP2017224755A | 2017-12-21 | |||
| JP2008042796A | 2008-02-21 | |||
| JP2011013330A | 2011-01-20 | |||
| JP2011180426A | 2011-09-15 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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