Title:
SOLID-STATE IMAGING DEVICE, PACKAGE, AND IMAGING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/281830
Kind Code:
A1
Abstract:
The present disclosure pertains to a solid-state imaging device, a package, and an imaging system which enable suppression of reduction in image quality. A solid-state imaging device according to an aspect of the present technology comprises: a photoelectric conversion unit configured by using a material having a smaller band gap energy than silicon; and a circuit board joined to the photoelectric conversion unit. The circuit board has a pixel signal generation circuit that generates a pixel signal having a voltage value corresponding to charges generated at the photoelectric conversion unit, a thermometer circuit that detects the temperature of the circuit board, and a temperature control signal generation circuit that acquires temperature information indicating the temperature detected by the thermometer circuit, and generates a temperature control signal on the basis of the acquired temperature information.
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Inventors:
KAWANO JUMPEI (JP)
NAKANO TOSHIAKI (JP)
TSUJI KIYOSHIGE (JP)
HARUYAMA KENICHI (JP)
NAKANO TOSHIAKI (JP)
TSUJI KIYOSHIGE (JP)
HARUYAMA KENICHI (JP)
Application Number:
PCT/JP2022/011327
Publication Date:
January 12, 2023
Filing Date:
March 14, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/361
Foreign References:
| JP2019134318A | 2019-08-08 | |||
| JP2004088353A | 2004-03-18 | |||
| JP2012049596A | 2012-03-08 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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