Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090244
Kind Code:
A1
Abstract:
A solid-state imaging device 1 according to the present invention is provided with: a semiconductor substrate 20 which has a main surface 20a that is provided with a plurality of photosensitive regions 3; and an insulating film 30 which is provided on the main surface 20a of the semiconductor substrate 20. If the main surface 20a of the semiconductor substrate 20 is taken as the reference surface K, the thickness T of the insulating film 30 from the reference surface K is 0.5 μm or more; a surface (main surface 30b) of the insulating film 30, said surface being on the reverse side of the main surface, is formed as a flat surface; and the main surface 20a of the semiconductor substrate 20 is provided with a plurality of kinds of bottom surfaces R, which are different from each other in the depth from the reference surface K, in the photosensitive regions 3.
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Inventors:
TAKIGUCHI RYO (JP)
KONO MAKOTO (JP)
OTA KEIICHI (JP)
TAKA TETSUYA (JP)
KONO MAKOTO (JP)
OTA KEIICHI (JP)
TAKA TETSUYA (JP)
Application Number:
PCT/JP2019/035770
Publication Date:
May 07, 2020
Filing Date:
September 11, 2019
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L27/146; H04N5/369
Domestic Patent References:
| WO2013190864A1 | 2013-12-27 | |||
| WO2017126329A1 | 2017-07-27 | |||
| WO2015001987A1 | 2015-01-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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